Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today.
Rambus Advances Server Memory Performance with the Industry’s First 5600 MT/s DDR5 Registering Clock Driver
Rambus Inc. (NASDAQ: RMBS), a chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology
SkyWater Technology, the trusted technology realization partner and Deca Technologies(Deca), a provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning within SkyWater’s advanced packaging facility in Florida.
Semtech Launches Upgraded LoRa Developer Portal
Semtech Corporation, a global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced the upgraded launch of the LoRa Developer Portal, which makes it easier for developers, regardless of experience level, to quickly build Internet of Things (IoT) devices connected with the LoRaWAN standard.
New Nanostructure Could Be the Key to Quantum Electronics
Using a completely new synthesis approach, nanostructures made of aluminium single crystals and the semiconductor germanium are jointly explored at TU Wien and CNRS-UGA Grenoble for future quantum technologies.
Contributing to Solve the Heat Concentration Problem in Power Semiconductors
In high-performance CPUs used in large servers and power semiconductors used in inverters for hybrid electric vehicles (HEVs), as the integration density rises and the higher the power consumption becomes, the semiconductor package is also becoming smaller.
2021 IEDM to Unveil the Latest Advances in Semiconductors and Related Technologies
The foundational elements of digital technologies – semiconductors and other micro/nanoelectronic devices – have become indispensable to modern life, and the place to learn about cutting-edge research in the field is the 67th annual IEEE International Electron Devices Meeting, to be held December 11–15, 2021 at the Hilton San Francisco Union Square hotel.
AI Chipmaker Hailo Raises $136 Million to Expand Edge AI Solutions as Global Demand Surges
AI chipmaker Hailo today announced it has raised$136 million in a Series C funding round led by Poalim Equity and Gil Agmon.
Alif Semiconductor and Arm Announced Record-Breaking Power Efficiency Breakthrough for Edge Node AI/ML Workloads
Measurements on Alif’s Ensemble MCU show a 76x increase in power efficiency per inference for image classification vs. Cortex-M55 alone, and 800x uplift in performance as compared to previous generation Cortex-M CPU cores.
Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM
Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology.
