Less than two weeks after IBM announced their 2-nanometer CMOS technology, UK website Verdict picked up on a paper published in Nature and somehow morphed that into a claim that TSMC had made breakthrough in 1-nm technology development.
Imec Reports First Electrical Demonstration of Integrated Forksheet Devices to Extend Nanosheets Beyond 2nm Technology Node
imec demonstrated for the first time fully functional integrated forksheet field-effect transistors (FETs), with short-channel control (SSSAT=66-68mV/dec) comparable to gate-all-around (GAA) nanosheet devices down to 22nm gate length.
Quantum-Si Signs Lease for Product Development and Operations Facility in San Diego Biotechnology Hub
Quantum-Si Incorporated, a company pioneering next-generation semiconductor chip-based proteomics, announced today that it has entered into a lease agreement with Phase 3 Real Estate Partners, Inc. to develop a 25,586-square-foot product development and operations facility in San Diego, CA.
Analog Devices Completes Allocation of Semiconductor Industry’s First Green Bond
Analog Devices, Inc. today published its 2020 Green Bond Report, which provides an update on the full allocation of the proceeds from its inaugural green bond offering, which closed on April 8, 2020.
Renault Group and STMicroelectronics Enter Strategic Cooperation on Power Electronics
Renault Group and STMicroelectronics today announced a strategic cooperation on the design, development, manufacturing, and supply to Renault Group of STMicroelectronics’ products and related packaging solutions for the power electronics systems of battery-operated and hybrid vehicles.
Electrons on the Edge: Atomically-Thin Quantum Spin Hall Materials
Quantum spin Hall insulators are a class of two-dimensional (2D) topological states of matter that are electrically insulating in their interior but, unlike semiconductors, carry a pair of one-dimensional (1D) metallic states, which are strictly confined to their edges.
Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets.
A More Robust Memory Device for AI Systems
A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
STMicroelectronics Brings Tower Semiconductor on Board 300mm Analog and Power Fab Under Construction in Italy
STMicroelectronics and Tower Semiconductor announced today an agreement by which ST will welcome Tower to its Agrate R3 300mm fab under construction on its Agrate Brianza site in Italy.
Supplyframe Announces the Launch of DesignSense Sales Intelligence
Many people today shop for and research potential purchases online. Semiconductor and electronic component buyers are no exception.
