Macronix International Co., Ltd. and Hon Hai Technology Group today announced the signing of an Asset Transaction Agreement for the sales of Macronix’s 6-inch wafer fab and equipment in Hsinchu Science Park to Foxconn for NT$2.52 billion.
Overcoming the Limitations of Scanning Electron Microscopy with AI
A joint research team from POSTECH and the Korea Institute of Materials Science (KIMS) applied deep learning to the scanning electron microscopy (SEM) to develop a super-resolution imaging technique that can convert a low-resolution electron backscattering diffraction (EBSD) microstructure images obtained from conventional analysis equipment into super-resolution images.
Brain Connectivity Can Build Better AI
A new study shows that artificial intelligence networks based on human brain connectivity can perform cognitive tasks efficiently.
SEMI Unveils Diversity, Equity and Inclusion Roadmap, Toolkit and Event Guidelines
SEMI, the trade association representing the global electronics design and manufacturing supply chain, today unveiled a Diversity, Equity and Inclusion Roadmap and Toolkit to help its more than 2,400 members transform the way they hire and retain employees and build a more diverse workforce.
“Fabrica 2.0 Machine” Replaces the “Tera 250” Name, Following the Latest Acquisition by Nano Dimension
Nano Dimension Ltd. announced today that Nanofabrica Ltd. and its 3D additively manufacturing (AM) printing system have been officially renamed following the acquisition by Nano Dimension in April 2021.
Nexperia Receives Bosch Global Supplier Award for the Second Time in a Row
Nexperia announced that it has received a prestigious Bosch Global Supplier Award for ‘Purchasing of direct materials – Mobility Solutions’.
Global Silicon Reclaim Wafers Market to Reach $840.4 Million by 2026
Silicon Reclaim Wafers market in the U.S. is estimated at US$120.7 Million in the year 2021.
New Printing Technique for Flexible Electronics
Researchers from the Daegu Gyeongbuk Institute of Science and Technology have developed a faster and more reliable way to print flexible digital devices.
Development of Neural Network for Environmental Adaptation, Doubling the Performance of Visual Recognition AI
Development of a deep learning technique that reduces the difference between image domains by separating and converting domain information of image capturing environments.
GaN Systems and ON Semiconductor Partner to Deliver Smaller, More Efficient, Lower Cost Power Solutions
GaN Systems and ON Semiconductor released a new 300W BTP-PFC Bridgeless Totem Pole Power Factor Correction (PFC) evaluation board.
