Shannon Davis

News and Web Editor

6960 Articles0 Comments

Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

3D Semiconductor Packaging Market Growth Opportunities in the Forthcoming Years with Forecast to 2023

As per the latest report published by Market Research Future (MRFR), the global 3D semiconductor packaging market is likely to reach a valuation of USD 37,472.7 million by the end of 2023, reflecting a healthy growth rate.

Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

NHanced Semiconductors Announces Dedicated High‑Volume Advanced Packaging Facility

NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.

Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors

Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.

STMicroelectronics Introduces Cost-Efficient NFC Transceiver

The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver supporting passive peer-to-peer functionality and NFC card-emulation mode as well as NFC reader operation.

Graphcore and SiPearl Announce Strategic Partnership

Graphcore, the British maker of the Intelligence Processing Unit (IPU), a new type of microprocessor specifically designed to support artificial intelligence workloads, and SiPearl, the Franco-German company that designs the high computing power and low consumption microprocessor for supercomputers, have entered into a strategic partnership.

ETEL’s New Advanced Motion Controller Offers Real-Time Processing for Complex Manufacturing

ETEL’s new UltimET Advanced is a powerful and versatile multi-axis motion controller now available to bring fast real-time processing and a higher level of flexibility to a variety of complex manufacturing applications.

High End FinFet ASIC Market To Approach $20 Billion

The global high end ASIC market will reach nearly $20 billion in five years, driven by high-performance computing applications in data processing and telecommunications, according to James Huang, Vice President, Alchip Technologies.

Gartner Says Global Chip Shortage Expected to Persist Until Second Quarter of 2022

The worldwide semiconductor shortage will persist through 2021, and is expected to recover to normal levels by the second quarter of 2022, according to Gartner, Inc.

Rice Lab Peers Inside 2D Crystal Synthesis

Rice University theorists simulate the molecular transitions that take place inside a furnace to create 2D molybdenum disulfide, a semiconductor that could find a home in next-generation electronics.