The development of an ultrathin magnet that operates at room temperature could lead to new applications in computing and electronics – such as high-density, compact spintronic memory devices – and new tools for the study of quantum physics.
TESCAN Launches Next Generation AutoSlicer Module for High Throughput TEM Sample Preparation
TESCAN ORSAY HOLDING a.s. announces its latest generation AutoSlicer module for unattended, semi-automated transmission electron microscope (TEM) lamella preparation in semiconductor failure analysis and materials science.
NVIDIA Inference Breakthrough Makes Conversational AI Smarter, More Interactive From Cloud to Edge
NVIDIA today launched TensorRT 8, the eighth generation of the company’s AI software, which slashes inference time in half for language queries — enabling developers to build the world’s best-performing search engines, ad recommendations and chatbots and offer them from the cloud to the edge.
NXP Semiconductors and MOTER Technologies Join Forces to Extend Connected Vehicle Insurance Opportunities
NXP Semiconductors N.V. and MOTER Technologies have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more.
GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
GlobalFoundries (GF) today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.
Scientists Take First Snapshots of Ultrafast Switching in a Quantum Electronic Device
They discover a short-lived state that could lead to faster and more energy-efficient computing devices.
Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
As a percent of worldwide total, China achieves largest increase in fab capacity at expense of all other regions, but still trails Taiwan, South Korea, and Japan in installed capacity.
Renesas Announces Schedule of Yamaguchi Factory Consolidation
Renesas Electronics Corporation (TSE: 6723), a supplier of advanced semiconductor solutions, today announced that it has decided to consolidate the Yamaguchi Factory (Ube, Yamaguchi Prefecture) of its wholly owned subsidiary, Renesas Semiconductor Manufacturing Co., Ltd. at the end of June 2022.
Aehr Receives $10.8 Million Order for Production Test and Burn-in of Silicon Carbide Power Semiconductors for Electric Vehicles
Aehr Test Systems today announced it has received a $10.8 million single purchase order from its lead silicon carbide test and burn-in customer for multiple FOX-XP systems and full sets of WaferPak Contactors to meet their increased production capacity needs.
STMicroelectronics Introduces New RF LDMOS Power Transistors
STMicroelectronics is adding a broad range of new devices to the STPOWER family of LDMOS transistors, which comprises three different product series optimized for RF power amplifiers (PAs) in a variety of commercial and industrial applications.
