NXP Semiconductors N.V. and TSMC today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16nm FinFET process technology.
Micron Unveils 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium.
EdgeCortix Collaborates With Cadence To Accelerate AI Chip Design
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that EdgeCortix, Inc. focused on artificial intelligence (AI) driven software and hardware acceleration solutions, specially designed for edge computing scenarios, has deployed multiple Cadence verification and digital tools to accelerate the design and verification of its edge AI chips.
A*STAR’s Institute of Microelectronics and NexGen Announce New Wafer Applications Joint Laboratory in Singapore
A*STAR’s Institute of Microelectronics (IME) and NexGen Wafer Systems (NexGen) have established a S$9 million wafer applications joint laboratory to develop chemical wet etching and wafer substrate thinning processes for semiconductor IC fabrication and 3D wafer level packaging technology.
Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field
Mission-critical and other high-assurance systems deployed worldwide are under rapidly evolving threats from cybercriminals who attempt to extract Critical Program Information (CPI) via the FPGAs that power them.
AI Chipmaker Hailo Partners with Lanner Electronics to Launch Next-generation AI Inference Solutions at the Edge
AI (Artificial Intelligence) chipmaker Hailo announced today its partnership with Lanner Electronics, to launch groundbreaking AI inference solutions for real-time computer vision at the edge.
Inova Semiconductors Implements YieldWatchDog as Yield Management Solution
DR YIELD software & solutions GmbH, provider of the smart data analytics solution YieldWatchDog, announces that they were selected by Inova Semiconductors GmbH to enable actionable insights into their chip test data.
CEA-Leti Launches Direct Analysis to Bring Speed and Efficiency to Food-Safety Testing
Armed with exclusive access to 11 CEA-Leti patents covering specialties such as DNA extraction and microscopic-sample diagnostics, CEA-Leti startup Direct Analysis has developed a pathogenic-bacteria-detection system for food manufacturers that takes one-fourth of the time of existing tests, can minimize stoppage of production lines and reduce food-product recalls and losses.
