Murata has introduced the BLM18KN_EH series of chip ferrite beads for noise suppression in power lines at temperatures up to 175°C.
Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its family of 8.2mm creepage photocouplers with three new devices designed for operation in harsh industrial automation equipment, solar inverter, and EV charger operating environments.
OmniVision Announces 0.61µm pixel, High Resolution 4K Image Sensor
OmniVision Technologies, Inc., a developer of advanced digital imaging solutions, today announced the OV60A―the world’s first 0.61 micron (µm) pixel high resolution CMOS image sensor that will revolutionize the capabilities of next-generation mobile phone cameras.
Global Organic CMOS Image Sensor Market is Expected to Grow at a CAGR of 12.2% from 2017 to 2028
The global Organic CMOS Image Sensor Market was valued at USD 1,086.7 million in 2020 and is projected to register a CAGR of 12.2% to reach USD 2,723.8 million by 2028 in the COVID-19 period.
Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21
Excluding Intel, the group would have shown a 29% jump in 1Q21/1Q20 sales.
AI Chipmaker Hailo Awarded Edge AI and Vision Product of the Year
The Hailo-8, the AI processor for edge devices from AI (Artificial Intelligence) chipmaker Hailo, has been selected as winner of the 2021 Edge AI and Vision Product of the Year Awards for “Best Edge AI processor.”
Synopsys Digital and Custom Design Platforms Certified for TSMC’s Latest 3nm Process Technology
Synopsys, Inc. today announced that TSMC has certified Synopsys’ digital and custom design solutions based on TSMC’s latest design-rule manual (DRM) and process design kits for its advanced 3-nanometer (nm) process technology.
A New ‘Gold Standard’ Compound for Generating Electricity from Heat
Thermoelectric power generators that make electrical power from waste heat would be a useful tool to reduce greenhouse gas emissions if it weren’t for a most vexing problem: the need to make electrical contacts to their hot side, which is often just too hot for materials that can generate a current.
“Bite” Defects in Bottom-Up Graphene Nanoribbons
Graphene nanoribbons (GNRs), narrow strips of single-layer graphene, have interesting physical, electrical, thermal, and optical properties because of the interplay between their crystal and electronic structures. These novel characteristics have pushed them to the forefront in the search for ways to advance next-generation nanotechnologies.
Winbond and Ambiq Collaborate on Ultra-Low Power, Intelligent IoT, and Wearables
Winbond Electronics Corporation and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
