SK hynix Inc. announced that it has started this month mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.
Technology that Restores the Sense of Touch in Nerves Damaged as a Result of Injury
Tel Aviv University’s new and groundbreaking technology inspires hope among people who have lost their sense of touch in the nerves of a limb following amputation or injury.
New Electronic Paper Displays Brilliant Colors
Imagine sitting out in the sun, reading a digital screen as thin as paper, but seeing the same image quality as if you were indoors. Thanks to research from Chalmers University of Technology, Sweden, it could soon be a reality. A new type of reflective screen — sometimes described as ‘electronic paper’ — offers optimal color display, while using ambient light to keep energy consumption to a minimum.
The Pennsylvania State University Plans to Install Samco Aqua Plasma and UV Ozone Cleaning Systems
Samco announces that the Nanofabrication Laboratory at the Pennsylvania State University Materials Research Institute (Penn State MRI Nanofab) has selected a complementary suite of surface treatment solutions from Samco consisting of an Aqua Plasma cleaning system and a UV ozone cleaning system as new additions to their specialized equipment toolsets for micro-and nanofabrication.
Backscatter Breakthrough Runs Near-Zero-Power IoT Communicators at 5G Speeds Everywhere
The promise of 5G Internet of Things (IoT) networks requires more scalable and robust communication systems — ones that deliver drastically higher data rates and lower power consumption per device.
Sourceability Global Distribution Agreement with Nexperia Broadens Sourcengine’s Component Offerings
Sourcengine today announced that it is making components from Nexperia, the expert in essential semiconductors, available worldwide.
Canaan Releases Self-developed Edge AI Chip, the Kendryte K510
Canaan Inc., a high-performance computing solutions provider, today announced the release of the Kendryte K510, an independently designed and developed RISC-V based edge AI chip, at the 2021 World Artificial Intelligence Conference.
Cirrus Logic Announces Agreement to Acquire Lion Semiconductor
Cirrus Logic, Inc. today announced that it has entered into an agreement to acquire California-based Lion Semiconductor for $335 million in cash.
3D Stacking Paves Way for Smaller, Power-Packed Computing Chips
Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.
A*STAR’s Institute of Microelectronics Teams with Major Industry Players in High Density System-in-Package Consortium for Heterogenous Chiplets Integration
The newly formed consortium will leverage IME’s expertise in FOWLP/2.5D/3D packaging.
