Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Cree and STMicroelectronics Expand Existing 150mm Silicon Carbide Wafer Supply Agreement

Cree, Inc., through its Wolfspeed business, and STMicroelectronics announced today the expansion of an existing multi-year, long-term silicon carbide wafer supply agreement.

Submerged Sensors to Control Wearable Electronics

Flexible and waterproof sensors that could unlock new applications for wearable electronics have been developed by scientists in Korea.

BrainChip Receives Akida Chips from Socionext America

BrainChip Holdings Ltd, a provider of ultra-low power high performance artificial intelligence technology, today announced it has received the first batch of Akida chips from its manufacturing run from Socionext America (SNA).

Steep Increase in Photoresists & Ancillaries Market Driven by Surge in Wafer Starts

TECHCET—the electronic materials advisory firm providing business and technology information— announced that resist sales for semiconductor manufacturing will top $2B in 2021, an 11% increase over 2020.

Xanadu and imec Partner to Develop Photonic Chips for Fault Tolerant Quantum Computing

Xanadu, a full-stack photonic quantum computing company and imec, a research and innovation center in nanoelectronics and digital technologies, have today announced a partnership to develop the next generation of photonic qubits based on ultra-low loss silicon nitride (SiN) waveguides. 

Combining Perovskite with Silicon, Solar Cells Convert More Energy from Sun

Many countries around the world are committed to reducing emissions or reaching net-zero emissions to meet the United Nations’ climate goals of maintaining temperature increases below 1.5 degrees Celsius by 2050.

QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets

QP Technologies (formerly Quik-Pak), a provider of microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility.

The New Reality: Opportunities in Augmented Reality to Explode in Coming Years

Lux Research foresees innovations and advancements that will drive smart glasses adoption in as little as two years and fully immersive AR glasses in as little as five years.

Project Aims to Make Quantum Computers Easier to Produce and Operable at Room Temperature

A UC Riverside materials scientist has received a $2 million grant from the National Science Foundation to improve the scalability of quantum computers by allowing them to operate at room temperature. 

2021 IEEE International Electron Devices Meeting Highlights Educational Opportunities in Leading-Edge Semiconductor Technologies

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the…