A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
STMicroelectronics Brings Tower Semiconductor on Board 300mm Analog and Power Fab Under Construction in Italy
STMicroelectronics and Tower Semiconductor announced today an agreement by which ST will welcome Tower to its Agrate R3 300mm fab under construction on its Agrate Brianza site in Italy.
Supplyframe Announces the Launch of DesignSense Sales Intelligence
Many people today shop for and research potential purchases online. Semiconductor and electronic component buyers are no exception.
MEMS Semiconductors Strengthen After Holding Up Well in 2020
Sensors and actuators made with MEMS technology are forecast to grow by high double-digit percentages in the next several years after starting a recovery in 2H20, says new report.
New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Lattice Semiconductor Corporation today launched the Lattice CertusPro-NX general purpose FPGA family.
Cyient Celebrates First Anniversary of IC Design and Development Center in Duisburg, Germany
AnSem, a Cyient company, announced the first anniversary of the acquisition of an integrated circuit (IC) design center in Duisburg, Germany.
Nordson Electronics Solutions Ships First SELECT Unit from New Global Manufacturing Facility
The relocation expands operations and capabilities for SELECT’s selective soldering systems used in electronics manufacturing.
GlobalFoundries Breaks Ground on New Fab in Singapore
GLOBALFOUNDRIES today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus.
KLA Launches New Portfolio of Automotive Products to Improve Chip Yield and Reliability
KLA Corporation announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection system, the C205 broadband plasma patterned wafer inspection system, the Surfscan SP A2/A3 unpatterned wafer inspection systems and I-PAT inline defect part average testing screening solution.
Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame
Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.
