Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.
ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET
ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.
Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.
Breathing New Life into Existing Tech: FT-IR Spectrometer Shows Molecular Orientation
Osaka Prefecture University observes the molecular orientation of thin-film materials with Fourier transform infrared spectroscopy (FT-IR) using an originally designed, 3D printed attenuated total reflectance (ATR) unit.
SIA Applauds Senate Introduction of FABS Act
The Semiconductor Industry Association (SIA) today applauded the introduction in Congress of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize greater semiconductor manufacturing in the United States.
Inducing and Tuning Spin Interactions in Layered Material
Magnetic-spin interactions that allow spin-manipulation by electrical control allow potential applications in energy-efficient spintronic devices.
Innovative Foundry Technologies Resolves Infringement Dispute with SMIC and Initiates New Patent Litigation
Innovative Foundry Technologies LLC (IFT) has resolved its patent dispute with Semiconductor Manufacturing International Corporation (SMIC).
AI System-on-Chip Runs on Solar Power
AI is used in an array of extremely useful applications, such as predicting a machine’s lifetime through its vibrations, monitoring the cardiac activity of patients and incorporating facial recognition capabilities into video surveillance systems.
New Manufacturing Technique for Flexible Electronics
Researchers at Stanford University have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100 nanometers in length – several times smaller than previously possible.
Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing
Semiconductor test equipment supplier Advantest Corporation is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).
