Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Automotive LiDAR Market Growth Sturdy at 30.4% CAGR to Outstrip $4,348.09 Million by 2027
The Automotive LiDAR Market Size was valued at US$ 521.35 million in 2019 and is projected to reach US$ 4,348.09 million by 2027; it is expected to grow at a CAGR of 30.4% during 2019–2027.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
MACOM Introduces New Semiconductor Process For High Voltage Capacitors
MACOM Technology Solutions Inc. announced that it has completed the development of a new high voltage capacitor semiconductor process.
ASM AMICRA Unveils Systems Incorporating X-Celeprint’s MTP Technology for High Volume Heterogeneous Integration of Ultra-thin Chips
ASM AMICRA Microtechnologies GmbH announced three new manufacturing systems that combine X-Celeprint’s Micro-Transfer Printing (MTP) and ASM AMICRA’s high precision die bonding technology to introduce the semiconductor industry’s first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.
Akoustis Announces Issuance of Nine New Patents
Akoustis Technologies, Inc. announced the issuance of nine new patents related to its innovative BAW resonators, piezoelectric materials, XBAW manufacturing process, wide-bandwidth RF filters and its applications in 5G mobile and other wireless devices.
Nano Dimension Acquires NanoFabrica Ltd.
Nano Dimension Ltd. announced today that it has signed and closed a definitive agreement to acquire NanoFabrica Ltd.
FormFactor Ranked as #1 Supplier of Semiconductor Probe Cards
FormFactor, Inc. was again ranked as the world’s number one supplier of semiconductor probe cards by market research firm VLSIresearch, after growing 18% in 2020.
Researchers Use Mikrotron Cameras in Networked Vision System Assisting Drivers in Making Evasive Maneuvers
Researchers at the the University of Tokyo have developed an evasive maneuver assist (EMA) system using an array of Mikrotron high-speed cameras capable of communicating with each other via a wireless network.
SIA Echoes National Security Leaders’ Call for Federal Investments in Chip Technology
The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer in support of a recent letter from top national security leaders to President Biden urging enactment of legislation to strengthen America’s technological edge.
