Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Biden-Harris Administration Announces Preliminary Terms with GlobalWafers

The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.

Silicon Photonics Light the Way Toward Large-Scale Applications in Quantum Information

Silicon-based frequency-entangled qubits enable secure quantum information distribution across a five-user quantum network without the need for trusted nodes.

Inorganic Ventures acquires PURE Analytical Laboratories

IV Labs Inc, the parent company of Inorganic Ventures, has acquired PURE Analytical Laboratories in a move to produce materials with higher purities than currently available and to create new, high-purity materials for emerging applications from semiconductors and computing to pharmaceuticals and diagnostic equipment.

Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024, ESD Alliance Reports

Electronic System Design (ESD) industry revenue increased 14.4% to $4,521.6 million in the first quarter of 2024 from the $3,951.1 million registered in the first quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.

Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians

The program will train facility technician apprentices over the next five years in Arizona.

Aitomatic Unveils SemiKong: AI Breakthrough Set to Reshape $500B Semiconductor Industry

Unveiled at SEMICON West 2024, SemiKong aims to revolutionize semiconductor processes and fabrication technology, potentially reshaping the $500B semiconductor industry in the next five years.

Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”

Adeia Inc. was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. 

Nanotronics Unveils Gen V AI Model and Two New, Affordable Inspection Products

Nanotronics is set to redefine industry standards with the introduction of its next generation AI, and two new hardware products that leverage it.

SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing

SEALSQ Corp announces the breakthrough adoption and future potential of its RISC-V technology. SEALSQ’s adoption of RISC-V will materialize with the first engineering samples in late 2024 and certification is expected to be ready for production in Q3 2025.

Pankaj Kukkal of NXP Semiconductors Reelected Board Chair Of Silicon Integration Initiative

Pankaj Kukkal, executive vice president of MCU/MPU Engineering for NXP Semiconductors, has been reelected to a third term as board chair of Silicon Integration Initiative for 2024-2025.