All of Samsung’s global semiconductor manufacturing facilities certified for reducing carbon emissions, water use and waste discharge.
Hua Hong Semiconductor Achieved Mass Production of 12” 90nm BCD
Hua Hong Semiconductor Limited, a global specialty pure-play foundry, announced that its 90nm BCD process has received wide recognition from customers for its high performance index and compact chip size, and mass production has been achieved on Hua Hong Wuxi’s 12” production line.
IBM Announces 2nm GAA-FET Technology – the Sum of “Aha!” Moments
IBM likes to create a stir once in awhile, and judging by the tech-press response in the last week or three, they have achieved that goal with their announcement of 2-nanometer CMOS technology, developed at their Albany research centre. This technology is expected to give a 45% performance boost or 75% power reduction, compared with a 7-nm process. Of course the question is, compared with what 7-nm process?
NXP Announces Two Processors on TSMC 16nm FinFET Technology
NXP Semiconductors N.V. and TSMC today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16nm FinFET process technology.
Micron Unveils 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium.
EdgeCortix Collaborates With Cadence To Accelerate AI Chip Design
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that EdgeCortix, Inc. focused on artificial intelligence (AI) driven software and hardware acceleration solutions, specially designed for edge computing scenarios, has deployed multiple Cadence verification and digital tools to accelerate the design and verification of its edge AI chips.
A*STAR’s Institute of Microelectronics and NexGen Announce New Wafer Applications Joint Laboratory in Singapore
A*STAR’s Institute of Microelectronics (IME) and NexGen Wafer Systems (NexGen) have established a S$9 million wafer applications joint laboratory to develop chemical wet etching and wafer substrate thinning processes for semiconductor IC fabrication and 3D wafer level packaging technology.
Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field
Mission-critical and other high-assurance systems deployed worldwide are under rapidly evolving threats from cybercriminals who attempt to extract Critical Program Information (CPI) via the FPGAs that power them.
