Cirrus Logic, Inc. today announced that it has entered into an agreement to acquire California-based Lion Semiconductor for $335 million in cash.
3D Stacking Paves Way for Smaller, Power-Packed Computing Chips
Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.
A*STAR’s Institute of Microelectronics Teams with Major Industry Players in High Density System-in-Package Consortium for Heterogenous Chiplets Integration
The newly formed consortium will leverage IME’s expertise in FOWLP/2.5D/3D packaging.
Winbond HyperRAM & SpiStack and Renesas RZ/A2M Accelerate the Construction of Embedded AI Systems
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
Shortage Threat to Semiconductor Materials from US Chip Expansion Plans
Is the US wet chemical supply-demand out of balance?
Rambus Completes Acquisition of AnalogX
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of AnalogX.
Western Digital Appoints Dr. Thomas Caulfield and Miyuki Suzuki to Its Board of Directors
Western Digital Corp. today announced that Dr. Thomas (Tom) Caulfield and Miyuki Suzuki have been appointed to its board of directors effective July 6, 2021.
Unlocking Radiation-Free Quantum Technology with Graphene
“Heavy fermions” are an appealing theoretical way to produce quantum entangled phenomena, but until recently have been observed mostly in dangerously radioactive compounds. A new paper shows it is possible to make them in subtly modified graphene.
Brooks Instrument Celebrates 75 Years of Innovation in Fluid Measurement and Control
Brooks Instrument is celebrating its 75th year providing high-precision fluid measurement and control instrumentation.
Renesas’ New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an innovative new IoT system design platform that significantly eases the prototyping of IoT systems.
