Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Oxford Instruments Demonstrate the Capabilities of Paragraf Graphene Hall Effect Sensors Under Extreme Conditions

Paragraf continues to push performance boundaries with its graphene Hall Effect sensors.

Ambiq Brings Intelligent Voice-Command to Battery-Powered Endpoint Devices

Ambiq today introduced the new Ambiq Voice-on-SPOT (VoS) Kit, designed for manufacturers to introduce voice-command into their IoT devices with faster time-to-market.

AIM Photonics Announces Appointment of Tod A. Laursen as Chair of Leadership Council

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced the appointment of Dr. Tod A. Laursen, as Chair of the AIM Photonics Leadership Council, which focuses on the strategic and technical direction of the Institute.

3D-Micromac Eliminates Critical Process Bottlenecks to MicroLED Display Manufacturing with New Laser Micromachining Platform

3D-Micromac AG today introduced microCETI — the first laser micromachining platform that supports all laser processes in microLED display manufacturing with the high throughput and precision, and low cost of ownership, needed for volume production requirements.

Peter Lee of Micron Tapped for Si2 Pinnacle Award

Peter Lee, director of a global team responsible for the DRAM design environment at Micron Technology, will receive the quarterly Silicon Integration Initiative Pinnacle Award.

Researchers Develop Magnetic Thin Film for Spin-Thermoelectric Energy Conversion

A team of researchers, affiliated with UNIST has recently introduced a new class of magnetic materials for spin caloritronics.

Samsung Unveils Industry-First Memory Module Incorporating New CXL Interconnect Standard

Samsung Electronics Co., Ltd. today unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard.

Veeco Announces Multi-System Lithography Order

Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300 Lithography System for the production ramp of advanced packaging chips.

Dialog Semiconductor Selected as SiFive Preferred Power Management Partner for RISC-V Development Platforms

Dialog Semiconductor plc today announced that it has extended its partnership with SiFive, Inc. a developer of RISC-V processors and silicon solutions.

Linton Expands in China, Offers Increased Capacity Just Eight Years After Acquiring Kayex

Dalian Linton NC Machine Co. Ltd. has opened a more than 70,000 square meter research and design center and manufacturing base in Xishan, Wuxi, China.