QP Technologies (formerly Quik-Pak), a provider of microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility.
The New Reality: Opportunities in Augmented Reality to Explode in Coming Years
Lux Research foresees innovations and advancements that will drive smart glasses adoption in as little as two years and fully immersive AR glasses in as little as five years.
Project Aims to Make Quantum Computers Easier to Produce and Operable at Room Temperature
A UC Riverside materials scientist has received a $2 million grant from the National Science Foundation to improve the scalability of quantum computers by allowing them to operate at room temperature.
2021 IEEE International Electron Devices Meeting Highlights Educational Opportunities in Leading-Edge Semiconductor Technologies
While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the…
Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the next generation of its widely implemented MIPI Display Serial Interface 2 (MIPI DSI-2) specification.
NTU Singapore Scientists Develop a Stretchable Sweat-Powered Battery for Wearable Tech
Scientists from Nanyang Technological University, Singapore (NTU Singapore) have developed a soft and stretchable battery that is powered by human perspiration.
AMD Announces Use of TSMC 3D Fabric for Stacked Vertical SRAM Cache, TechInsights Confirms Current Ryzen 5950X is TSV-Capable
At Computex a couple of months ago Lisa Su of AMD gave a keynote talk detailing their new products, but at the tail end she surprised attendees by discussing their advancements in packaging technology.
Heavily Enriched: An Energy-Efficient Way of Enriching Hydrogen Isotopes in Silicon
Deuterium, a heavier but less abundant version of the hydrogen atom, has many practical applications. Unfortunately, producing deuterium and using it to protect silicon-based semiconductors requires a lot of energy and very expensive deuterium gas. Now, scientists from Japan have discovered an energy-efficient exchange reaction to swap hydrogen atoms for deuterium on the surface of nanocrystalline silicon. Their results pave the way to more durable electronic devices while keeping costs and the environmental impact low.
Intel Introduces New High-Performance Graphics Brand: Intel Arc
Intel today revealed the brand for its upcoming consumer high-performance graphics products: Intel Arc.
SEMI Teams with the Manufacturing Institute to Build Pathways to Electronics Careers for U.S. Military Veterans
SEMI today announced a new partnership with Heroes MAKE America, an initiative of the Manufacturing Institute (MI) to build connections between the U.S. military community and the manufacturing industry.
