The EVG®880 LayerRelease system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2024 at the Moscone Center in San Francisco.
Kaman Measuring Highlights High Precision Displacement Sensors for Extreme Environments
The Measuring Division of Kaman Precision Products, Inc. highlights the availability of high precision displacement sensors for extreme environments such as power generation including nuclear and aerospace propulsion, materials research and development, with operating temperatures from -320°F to +1000°F (+1200°F short term) at pressures up to 5000 psi.
Si2 Announces Recipients of Annual Power of Partnerships Award
Silicon Integration Initiative has announced the winners of the annual Power of Partnerships Award, which recognizes the Si2 volunteer teams that have made the most significant contributions to the success of the electronic design automation industry.
ISE Labs Expands Capabilities, Doubles Lab Space with Opening of Second Silicon Valley Location
ISE Labs, Inc., a provider of semiconductor engineering services, today announced it is broadening customer access to its world-class capabilities with the opening of a second U.S. facility, located in San Jose, Calif.
Compact and Scalable Multiple-Input Multiple-Output Systems for Future 5G Networks
A 28GHz time-division multiple-input multiple-output (MIMO) receiver with eight radio frequency elements, each occupying just 0.1 mm², has been developed by researchers at Tokyo Tech using 65nm CMOS technology.
Morse Micro Appoints Blake Hu as Vice President and Country Manager of Greater China and Southeast Asia
Morse Micro, a fabless semiconductor company and innovator in Wi-Fi HaLow technology, today announced the appointment of Blake Hu as the new Vice President and Country Manager of Greater China and Southeast Asia.
Mouser Electronics Awarded for Outstanding Performance from its Manufacturer Partners
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced that it has received 25 top business awards from its manufacturer partners for best-in-class performance during 2023, including over a dozen Distributor of the Year (DOY) Awards.
GCT Semiconductor and Kyocera Sign Development and Partnership Agreement
GCT Semiconductor Holding Inc. and Kyocera announce a collaboration to develop a 5G reference platform for customer premise equipment (CPE) and fixed wireless access (FWA) devices.
JEDEC Approaches Finalization of HBM4 Standard
JEDEC Solid State Technology Association today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.
Accenture Acquires Cientra to Expand Silicon Design Capabilities
Accenture has acquired Cientra, a silicon design and engineering services company, offering custom silicon solutions for global clients. The terms of the acquisition were not disclosed.
