SEMI today announced its participation as an industry expert in a study by researchers in Coventry University’s Institute for Future Transport and Cities’ (IFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers.
Silicon Wafer Supplier Okmetic Expands Its RFSi Portfolio
Okmetic, the supplier of advanced silicon wafers for the manufacture of microelectromechanical systems and sensors, today announced the release of UF-RFSi, a tailored silicon substrate dedicated for thin film surface acoustic wave (TF-SAW) hybrid structures.
Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion
Magnachip Semiconductor Corporation, the South Korean leader in display and power solutions, today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners.
CAE Strengthens Presence in Asia with Seven New Facilities
CAE, the industry’s first software and data-driven physical commodity trader for semiconductor capital equipment and commodities, announces a strengthened presence in the Asia-Pacificregion with offices in Japan, Taiwan, China, Korea, Singapore, India and Australia.
Deciphering the Secrets of Printed Electronics
We live in a world where we want our electronics to be flexible, bendable and stretchable apart from being intelligent. Printed electronics technology has emerged as the main route to enable this vision.
SME Announces Geoffrey Boothroyd Outstanding Young Manufacturing Engineers
The 14 awardees, age 35 or younger, are being recognized for their exceptional contributions and accomplishments in manufacturing throughout the early stages of their careers.
STMicroelectronics and OQmented to Jointly Develop, Manufacture, and Market Advanced MEMS Mirror-Based Laser-Beam Scanning Solutions
The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS-mirror-based laser-beam scanning (LBS) solutions in the market.
TopLine Awarded US Patent for CCGA Lead Free Solder Columns
TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates.
Samsung and Marvell Unveil New System-on-a-Chip to Advance 5G Networks
Samsung Electronics Co., Ltd. and Marvell today announced that the companies jointly developed a new System-on-a-Chip (SoC) to enhance 5G network performance.
Keysight Solutions Deployed by MediaTek to Validate First 5G Modem with mmWave Spectrum Capabilities
Integrated 5G test solutions speed market introduction of new designs.
