Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Automotive MCU Sales to Surge 23% in 2021 Despite Shortages

32-bit designs are expected to generate almost 77% of automotive microcontroller revenues this year, followed by 18% from 16-bit and 6% from 8-bit, says Mid-Year Update report.

With AI, Your Car Can Detect Potholes

The Korea Institute of Civil Engineering and Building Technology (KICT) has announced the development of an ‘AI-based automatic pothole detection system’.

Mobix Labs Completes Acquisition of Cosemi Technologies

Mobix Labs Inc. today announced that it has closed its previously reported acquisition of Cosemi Technologies Inc.

Samsung Introduces the Industry’s First 5nm Processor Powering the Next Generation of Wearables

Samsung Electronics Co., Ltd. today announced its new wearable processor, the Exynos W920.

WF6 and NF3 Demand Expected To Outstrip Supply By 2025 Driven By 3D NAND Memory Evolution

2021 recovery for specialty gases stronger than first anticipated.

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems

Microchip Technology Inc. has solved this challenge by cutting static power consumption for its mid-bandwidth Field Programmable Gate Arrays (FPGAs) and FPGA System-on-Chip (SoC) devices in half and giving them the smallest thermal footprint and best performance and compute horsepower compared to all alternative devices in their class.

ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D NAND, DRAM and Advanced Logic Manufacturing

ACM Research, Inc. announced the launch of its Bevel Etch product, which further expands ACM’s comprehensive offering of wet tools.

Macronix and Foxconn Sign Asset Transaction Agreement for 6-inch Wafer Fab

Macronix International Co., Ltd. and Hon Hai Technology Group today announced the signing of an Asset Transaction Agreement for the sales of Macronix’s 6-inch wafer fab and equipment in Hsinchu Science Park to Foxconn for NT$2.52 billion.

Overcoming the Limitations of Scanning Electron Microscopy with AI

A joint research team from POSTECH and the Korea Institute of Materials Science (KIMS) applied deep learning to the scanning electron microscopy (SEM) to develop a super-resolution imaging technique that can convert a low-resolution electron backscattering diffraction (EBSD) microstructure images obtained from conventional analysis equipment into super-resolution images.

Brain Connectivity Can Build Better AI

A new study shows that artificial intelligence networks based on human brain connectivity can perform cognitive tasks efficiently.