Power converters play an essential role in electric vehicles and solar panels, for example, but tend to lose a lot of power in the form of heat in the electricity conversion process. Thanks to a new type of transistor developed at EPFL, these converters can perform at substantially improved efficiencies, especially in high-power applications.
Scientists Uncover a Process That Stands in the Way of Making Quantum Dots Brighter
The results have important implications for today’s TV and display screens and for future technologies where light takes the place of electrons and fluids.
Mobile Phone Accessories Demand Is Surging; Protective Cases & Covers Will Account for Nearly 20% Sales: New Study
The increasing application of mobile phones and the expansion of 5G technology to ease operations and help in the smoother functioning of these devices are expected to have significant impact on mobile phone accessories market.
High-Accuracy Op Amp from STMicroelectronics Targets Energy-Efficient Power Conversion
The STMicroelectronics TSV7722 precision high-bandwidth operational amplifier, with gain-bandwidth of 22MHz and slew rate of 11V/μs, is well-suited for high-speed signal conditioning and accurate current measurement in power-conversion circuits and optical sensors.
Kneron Enters The Autonomous Car Race
Kneron, an AI chip and software developer, has entered the autonomous car race with a number of strategic partnerships.
Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications
Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
Semiconductor Materials Supply-Chain Shortages
TECHCET CA LLC’s prediction of a wet chemical supply fallout is materializing.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Intevac, Inc. today announced an INTEVAC MATRIX PVD order for fan-out applications in the advanced semiconductor packaging market.
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
Cadence Design Systems, Inc. today announced that it has collaborated with GLOBALFOUNDRIES to successfully tape out a Cadence Tensilica test chip on GF’s 22FDX platform.
