BrainChip Holdings Ltd. ended the 2020 calendar year having made significant strides in the development of its technology backed by the launch of its Early Access Program (EAP), availability of Akida evaluation boards, new partnerships, and expansion of its executive leadership and global facilities.
Semtech to Enable 50Gbps PAM4 Front Haul 5G Wireless Deployment with Industry’s First 5G Front Haul Tri-Edge CDR IC Solution
Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments.
IAR Systems Announces Availability of RISC-V Development Tools with Certification for IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the availability of a certified edition of its development toolchain for RISC-V.
proteanTecs Joins the TSMC IP Alliance Program
proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC’s Open Innovation Platform (OIP).
Heat-Free Optical Switch Would Enable Optical Quantum Computing Chips
In a potential boost for quantum computing and communication, a European research collaboration reported a new method of controlling and manipulating single photons without generating heat. The solution makes it possible to integrate optical switches and single-photon detectors in a single chip.
Thermo Scientific Spectra Ultra Offers a Leap Forward for Advanced Materials Characterization
Thermo Fisher Scientific, the world leader in serving science, today unveiled the Thermo Scientific Spectra Ultra, a next-generation scanning transmission electron microscope ((S)TEM) that offers structural and chemical insight on a wide range of materials at atomic-scale resolution.
Busch Vacuum Solutions USA Acquires Long-Term Sales Channel Partner
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors and systems, announces the acquisition of Jennings Associates Inc. (dba Jennings Alberts Inc) a distributor for new equipment, maintenance, and repair for vacuum pumps blowers and heat exchangers.
CEA-Leti Announces 16 Papers to be Presented at Photonics West 2021 and a Virtual Workshop on March 25
CEA-Leti, a technology research institute of CEA Tech, will present 16 papers during Photonics West 2021, March 6-11, including an invited paper, “Advanced roughness characterization for 300mm Si photonics patterning & optimization”.
ams Invests in New Imaging Center of Excellence in Rochester, NY to Boost Sensor-enabled Consumer Imaging Expertise
ams is establishing an imaging center of excellence producing consumer image sensors and product validation to support key US customers from the Riverwood Tech Campus in Rochester, New York, USA.
Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices
Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra).
