Magnachip Semiconductor Corporation announced today that the Company has commenced full-scale mass production of its first 120Hz High Frame Rate (HFR) OLED display driver IC (DDIC) for QHD flexible displays, following the successful product release and initial production in 2020.
Infinitesima Ships First RPM 3D System
Infinitesima Ltd announced the shipment of the first RPM 3D system to jointly develop 3-dimensional metrology applications for characterisation of semiconductor devices in collaboration with imec.
Evan Petridis Joins Eta Compute
Eta Compute Inc., the leader in energy-efficient endpoint AI solutions for intelligent sensing anywhere, announced that Evan Petridis joined the company as Chief Product Officer and Executive Vice President of Systems Engineering.
Ali Sadigh Joins Si2 Technical Team
Ali Sadigh, a technical professional with more than 25 years of experience in computational electromagnetics, circuit simulation and industrial data acquisition and management, has joined Silicon Integration Initiative as a principal software design engineer.
Shaping the Future Innovations in Maintenance – Part 1
By Alan Ifould At a time of renewed focus on digital transformation, business leaders are seeing just how importantoperational resilience is when meeting performance objectives. Fast and flexible operations from the clean room to the subfab are propelling customers ambitious growth targets, but how are customers navigating this landscape of change and where remains the unlocked potential?
CMP Consumables US$2.9B in 2021 for IC Fabs
TECHCET announces that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is expected to grow over 13% year-over-year (YoY) to US$2.93 billion in 2021.
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
ClassOne’s Next-Generation SoftSeal Plating Rotor Enhances Performance of Solstice Electroplating Systems
Semiconductor equipment manufacturer ClassOne Technology has just released its proprietary new SoftSeal Plating Rotor, designed to enhance processing performance on the company’s Solstice electroplating systems. The announcement was made by ClassOne’s CEO, Byron Exarcos and Senior Technology Director, John Ghekiere.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
European SEMI Award Honors KU Leuven, TU Dresden and CEA-Leti for Key Chip Industry Contributions
The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology.
