Thermo Fisher Scientific, the world leader in serving science, today launched the Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam. The system, a plasma focused ion beam scanning electron microscope, reduces time-to-data from days to hours for inline through-stack metrology and verification of high-aspect ratio structures.
Teradyne Announces New President of Universal Robots
Teradyne, Inc. today announced that Kim Povlsen has been appointed President of Universal Robots.
AI Chip Market Juggernaut Continues According to New Linley Group Report
Demand for deep-learning accelerator (DLA) chips, also known as artificial intelligence (AI) processors, continues to be strong in spite of the pandemic.
A Performance Leap for Graphene Modulators In Next Generation Datacom and Telecom
Over the past years, global data traffic has experienced a boom, with over 12.5 billion connected devices all over the world. The current world-wide deployment of the 5G telecommunications standard is triggering the need for smaller devices with enhanced performances, such as higher speed, lower power consumption and reduced cost as well as easier manufacturability.
Tapping Into Waste Heat for Electricity by Nanostructuring Thermoelectric Materials
In our ongoing struggle to reduce the usage of fossil fuel, technology to directly convert the world’s waste heat into electricity stands out as very promising. Thermoelectric materials, which carry out this energy conversion process, have, thus, recently become the focus of intense research worldwide.
Court Dismisses ROHM Semiconductor USA’s Lawsuit for Declaratory Judgment of Noninfringement of MaxPower Semiconductor’s Patents and Compels Arbitration
MaxPower Semiconductor, Inc. (MaxPower), provider of high-performance power semiconductor products, today announced that, following a hearing on February 4, 2021, the U. S. District Court for the Northern District of California dismissed ROHM Semiconductor USA LLC (ROHM USA)’s complaint for declaratory judgment of noninfringement of MaxPower’s patents.
U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a strategic partnership with the U.S. Department of Defense (DoD) to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s Fab 8 in Malta, New York.
Immersion Signs Korean-Based Woory Industrial to a New Multi-Year License for Haptic Technology Use in Automotive Touchscreens
Immersion Corporation, the leading developer and provider of technologies for haptics, today announced that it has signed a multi-year license agreement with Woory Industrial Co. Ltd.
NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today released Project Call 6.0 (PC 6.0). The latest call for proposals seeks to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing.
Semiconductor Industry Leaders Urge President Biden to Prioritize Funding for Semiconductor Manufacturing, Research
The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.
