The Southwest Advanced Prototyping (SWAP) Hub, based at Arizona State University, has been awarded nearly $7.8 million in funding by the CHIPS and Science Act for an innovative project led by Idaho Scientific to develop the ARC-V Secure Processor.
TXOne Networks Expands Edge Series of OT-Native Network Security Appliances
The product family is supercharged with new models and a powerful firmware upgrade.
Empower Debuts Revolutionary AI Power Delivery Platform to Solve Critical Technology Roadblock
Empower Semiconductor today unveiled the Crescendo vertical power delivery platform to address the growing power demands of artificial intelligence (AI) and high-performance computing (HPC) applications.
ZEISS Microscopy Opens Semiconductor Applications Laboratory in Dresden
ZEISS has announced it recently opened the ZEISS Microscopy semiconductor applications lab in Dresden.
Hurricane Helene Could Have a Significant Impact on High Purity Quartz, Semiconductor Supply
A tropical storm, remnants of Hurricane Helene, ripped through the western North Carolina mountain town of Spruce Pine last week, disrupting quartz supply operations at both Sibelco and The Quartz Corp.
DENSO and ROHM Agree to Start Consideration of Strategic Partnership in the Semiconductor Field
DENSO CORPORATION and ROHM Co., Ltd. announced that the two companies have agreed to start consideration of strategic partnership in the semiconductor field.
BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
BrainChip Holdings Ltd today introduced the Akida Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.
eBeam Initiative Survey of Semiconductor Luminaries Predicts Photomask Market Growth and Increasing Investments in Mask Inspection and Multi-beam Mask Writing
Results of 13th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
