SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, and Osaka R&D venture ArchiTek Corporation today announced ArchiTek’s first in-house developed AI processor, AiOnIc, featuring the ArchiTek Intelligence Pixel Engine (aIPE), and SiFive E3-Series RISC-V processor Core IP.
Size Matters When It Comes to Atomic Properties
A study from Chalmers University of Technology, Sweden, has yielded new answers to fundamental questions about the relationship between the size of an atom and its other properties, such as electronegativity and energy.
Nordson Electronics Solutions to Showcase Printed Circuit Board Assembly and Semiconductor Packaging Equipment at Productronica China and SEMICON China Tradeshows
Nordson Electronics Solutions are pleased to announce they will showcase many new dispensing, conformal coating, selective soldering, and surface treatment products and technologies at two events: Productronica China (Hall E6 booth #6202) and SEMICON China (Hall N4, booth #4022), both held at the Shanghai New International Expo Centre, Shanghai, China, March 17 – 20, 2021.
Deca Collaborates With ASE and Siemens to Launch APDK Design Methodology
Deca announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software.
Keysight’s 5G Device Test Solution Recognized for Innovative Breakthrough in Mobile Technology by GTI
Keysight Technologies, Inc. has been recognized by Global TD-LTE Initiative (GTI) as the most innovative breakthrough in mobile technology for the company’s 5G device test solution, based on Keysight’s network emulation platform.
Integrated Passive Devices Market is Projected to Reach USD 2 Billion by 2026
According to a recent study from market research firm Global Market Insights, The integrated passive devices market growth shall be fostered by the numerous features offered by IPDs system such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance and output, and better flexibility.
Monozukuri Joins ESD Alliance
Monozukuri Technologies, the first EDA company to market a proven IC/package co-design tool, today became the newest member of the Electronic System Design Alliance, a SEMI Technology Community.
GaN Systems Introduces the Industry’s Smallest and Smartest 100W GaN Charger Reference Design
GaN Systems announced today the release of the industry’s smallest 100W dual USB-C intelligent PD GaN charger.
Former Foxconn VP Richard Vincent Joins Adapdix as Chief Revenue Officer to Drive Expansion of Edge AI Platform
Adapdix Corporation, the leader in EdgeOps automation software, today announced that it has appointed Richard Vincent as Chief Revenue Officer (CRO).
Targeting Cancer Detection & Identification of Microorganisms, CEA-Leti Develops Mid-Infrared, Spectral-Imaging Technique
CEA-Leti scientists have developed a lensless, infrared spectral-imaging system for medical diagnostics.
