Veeco Instruments Inc. today announced that National Chiao Tung University (NCTU), based in Hsinchu, Taiwan, has selected Veeco to be an essential collaborator in their initiative to drive Taiwan’s semiconductor production through 2035.
Fast, Efficient Ultrasonic Scanning of Large Composite Components
Olympus’ new RollerFORM XL scanner answers the demand for a wide-coverage and easy-to-implement phased array tool to accelerate the inspection of composite components with large surface areas.
Park Systems Selected for Forbes Asia’s Best Under a Billion list for 2020
Park Systems was selected this year for Forbes Asia’s Best Under A Billion list spotlighting 200 top performing publicly listed companies in the Asia-Pacific region with sales under $1 billion.
Power Management ICs Market Is Estimated To Account For US$ 5,142.17 Mn in Terms of Value by the End of 2027
The global power management ICs market is estimated to account for US$ 5,142.17 Mn in terms of value by the end of 2027, exhibiting a CAGR of 5.3% during the forecast period (2020-2027), as highlighted in a new report published by Coherent Market Insights.
Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
Intel today announced that its board of directors has appointed 40-year technology industry leader Pat Gelsinger as its new chief executive officer, effective Feb. 15, 2021. Gelsinger will also join the Intel board of directors upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15.
Gowin Semiconductor Embeds 64Mb HyperRAM DRAM from Winbond
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
SOI Industry Consortium Joins SEMI as Strategic Association Partner
SEMI today announced that the SOI Industry Consortium, a leading industry organization representing the complete SOI-based microelectronics value chain, has joined SEMI as a Strategic Association Partner effective January 1, 2021.
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation Inc. today announced the availability of its new Dragonfly G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced packaging and specialty device manufacturers.
Virtual FLEX 2021 to Showcase Leading-Edge Innovations to Make the World Safer
The latest advances in flexible and printed electronics for a safer future will take center stage at the 20th anniversary Flexible Hybrid Electronics Conference and Exhibition(FLEX Conference 2021), February 22-26.
Syntiant Surpasses Milestone of 10 Million Processors Shipped
Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced that it has shipped more than 10 million of its Syntiant NDP100 and Syntiant NDP101 Neural Decision Processors (NDPs) to customers across the globe.
