Skyworks Solutions, Inc. today announced that it has entered into a definitive agreement with Silicon Laboratories Inc.
New Alloy Can Directly Reduce the Weight of Heat Removal Systems by a Third
The new alloys created by NUST MISIS scientists in cooperation with LG Electronics will help reduce the weight of radiators and heat removal systems in electric vehicles and consumer electronics by one third.
Nondestructive Characterization Technique Helps Gallium Nitride Crystal Developments
Researchers from Osaka University report a nondestructive method for identifying threading dislocations in GaN substrates that could help to improve quality and improve yields.
Silicon Labs Appoints Daniel Cooley as Chief Technology Officer
Silicon Labs today announced the appointment of Daniel Cooley – formerly chief strategy officer – to chief technology officer.
Visionox Technology, Inc. and Universal Display Corporation Extend Long-Term OLED Agreements
Universal Display Corporation and Visionox Technology, Inc. today announced the extension of their long-term OLED material supply and license agreements.
Patching Up Your Health
Researchers at Osaka University and JOANNEUM RESEARCH develop ultrathin self-powered e-health patches that can monitor a user’s pulse and blood pressure, which may lead to new flexible motion-based energy harvesting devices.
ROHM Introduces New White Chip LEDs
ROHM Semiconductor today introduced their new CSL1104WB ultra-compact, high luminous intensity white chip LEDs.
Semtech Accelerates Technology Deployments Aimed at Enabling a Better World
Semtech Corporation is amplifying its mission to make the planet a smarter, more connected and sustainable place by providing a new Internet of Things (IoT) platform
STMicroelectronics Joins mioty Alliance
Joining the mioty Alliance, which maintains the specifications and promotes the technology, ST has announced availability of a protocol stack from ST Authorized Partner Stackforce that allows customers to create mioty devices using the STM32WL wireless System-on-Chip (SoC).
Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm
Rambus Inc. announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsung’s advanced 14/11nm FinFET process.
