Teledyne Technologies Incorporated and FLIR Systems, Inc. jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion.
CONTACT Software Expands Partner Network at High-Tech Hub Taiwan
The CONTACT Global Ecosystem has a new partner in the “Silicon Valley” of Taipei. PilotSoft Technology, specializing in product design and development management applications, now supports Taiwan’s high-tech industries and contract manufacturers with outstanding solutions and services around the CONTACT Elements platform.
What to Expect from the IC Industry in 2021
The year 2020 was a most unusual and challenging year for businesses and consumers.
New Electron Microscopy Technique Offers First Look at Previously Hidden Processes
Northwestern researchers have developed a new microscopy method that allows scientists to see the building blocks of “smart” materials being formed at the nanoscale.
Theory Describes Quantum Phenomenon in Nanomaterials
Theoretical physicists Yoshimichi Teratani and Akira Oguri of Osaka City University, and Rui Sakano of the University of Tokyo have developed mathematical formulas that describe a physical phenomenon happening within quantum dots and other nanosized materials.
Tachyum Maximizes Business Opportunities with Expansion to Nevada
Tachyum today announced that it is leveraging business-friendly market conditions enabled by local and state government regulations and recent industrial investments in Nevada to expand operations and maximize its business opportunities.
IBM Selected for Department of Defense Award to Support Advancing the United States Microelectronics Technology Design Capabilities
IBM today announced a Phase 1 Other Transactions Agreement under the Rapid Assured Microelectronics Prototypes (RAMP) Advanced Commercial Capabilities Project through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA) to support advancing U.S. microelectronics technology.
Cobham Advanced Electronic Solutions Receives $48M Contract for Medical Imaging Electronics
Cobham Advanced Electronic Solutions (CAES) recently received a $48M contract to support the medical imaging industry, providing Application Specific Integrated Circuits (ASICs) and product support.
Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research
Palomar Technologies announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder.
New Discovery Brings Analogue Spintronic Devices Closer
The observation of nonlinearity in electron spin-related processes in graphene makes it easier to transport, manipulate and detect spins, as well as spin-to-charge conversion. It also allows analogue operations such as amplitude modulation and spin amplification.
