Laser-made, ultra-thin material enables precise, self-powered tracking of healing wounds.
Ex-TSMC Exec Urges Stronger Taiwan-U.S. Cooperation Amid Chip Tariff Threat
If the United States imposes tariffs on Taiwan-made semiconductors, Taiwan should work actively to enhance industrial cooperation with the U.S. to mitigate potential impacts, according to a former executive at Taiwan Semiconductor Manufacturing Co. (TSMC).
Strategic Materials Conference 2025 to Highlight the New Era of Materials Innovation
With advanced materials as a critical enabler of semiconductor growth applications, the Strategic Materials Conference (SMC) 2025 will gather top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest advancements in materials innovation.
Salience Labs Closed Series A Round Led by Applied Ventures and ICM HPQC Fund
Applied Ventures and ICM HPQC Fund are joined by Braavos, and continued participation from existing investors Oxford Sciences Enterprises, Cambridge Innovation Capital, and leaders from the global semiconductor industry including Silicon Catalyst and Jalal Bagherli.
Game-Changer for TV Screens: New Inkjet-Printed QLEDs Break Efficiency Records
Researchers have achieved a monumental leap in the efficiency and stability of inkjet-printed quantum-dot light-emitting diodes (QLEDs) by employing a pressure-assisted thermal annealing (PTA) technique, which enables the acquisition of highly ordered quantum-dot (QD) thin films via inkjet printing.
Nearfield Instruments Receives Purchase Orders from Major US Customer and Establishes Nearfield Instruments USA Inc.
Nearfield Instruments, a provider of advanced metrology and inspection solutions for the semiconductor industry, announced the establishment of its U.S. subsidiary, Nearfield Instruments USA Inc.
Initiation of Joint Research for Achieving High Accuracy in Evaluating Thermal Diffusivity of Silicon Nitride Ceramic Substrates
Silicon nitride ceramic substrates play a pivotal role in Active Metal Brazing (AMB) substrates for power modules whose applications include inverters for electric vehicle (EV) and hybrid electric vehicle (HEV) motor control.
NXP Agrees to Acquire Edge AI Pioneer Kinara
NXP Semiconductors N.V. today announced it has entered into a definitive agreement to acquire Kinara, Inc., an industry leader in high performance, energy-efficient and programmable discrete neural processing units (NPUs).
Brewer Science Welcomes New Chief Business Officer
Ms. Khobadandeh brings decades of industry experience to Brewer Science.
Toward Sustainable Computing: Energy-Efficient Memory Innovation
SOT-MRAM memory technology could replace cache memory in computer architecture in the future.
