Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

ACM Research Strengthens Atomic Layer Deposition Portfolio with Qualification of Thermal and Plasma-Enhanced ALD Furnace Tools

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool.

Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights

In a series of escalating trade measures, China announced on December 3, 2024, a complete export ban to the U.S. on rare earth materials, including gallium, germanium, antimony, and superhard materials.

Deloitte’s 16th Annual ‘Tech Trends’ Report Reveals AI Is Quickly Becoming Foundational to the Modern Enterprise

Deloitte’s 16th annual “Tech Trends” report — built on deep cross-industry experience and real-world stories — shines a light on the following trends poised to graduate from sensational to foundational over the next 18-24 months. 

Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles

Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a provider of silicon to systems design solutions, to enable a solution that will shorten design cycle time.

Tim Keating Joins AMD as Senior Vice President, Government Relations and Regulatory Affairs

AMD today announced that Tim Keating has joined the company as senior vice president, Government Relations and Regulatory Affairs, effective today.

CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node

CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.

SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects

The Semiconductor Industry Association applauded the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia. 

Lam Research Introduces the Semiconductor Industry’s First Collaborative Robot for Fab Maintenance Optimization

Dextro’s robotic arm delivers precision and accuracy to help chipmakers drive yield improvement.

xMEMS Labs Announces the First Public Demos of its Sycamore MEMS Loud Speaker and Micro-Cooling Fan-on-a-Chip Solutions at CES 2025

xMEMS Labs today announced that CES 2025 will be the first public demonstrations of its latest MEMS innovations – the xMEMS Sycamore loud speaker and µCooling fan-on-a-chip (January 7-10, Venetian Hotel Suite 29-235).

Advantest Launches KGD Test Cell for Power Semiconductors

Semiconductor test equipment supplier Advantest Corporation today announced an integrated test cell designed to maximize die-level test yields for wide-bandgap (WBG) devices essential to power semiconductors.