Today at the 2024 International Conference on Silicon Carbide and Related Materials, ASM International N.V. (Euronext Amsterdam: ASM) introduced the PE2O8 silicon carbide epitaxy system, a new, dual chamber, platform for silicon carbide (SiC) epitaxy (Epi).
RIBER Receives Order to Equip Autonomous Pilot Line for the Design and Manufacturing of Optical Devices in Europe
RIBER is announcing the sale of a fully automated MBE 412 cluster platform in Finland.
SWAP Hub Team Awarded CHIPS Act Funded Project
The Deptartment of Defense has announced that the Southwest Advanced Prototyping (SWAP) Hub based at Arizona State University (ASU) has been awarded $5M in funding by the CHIPS and Science Act for a Multi-MHz, High Density, Ultra-fast RADAR Power Convert project that will advance radar power systems in critical defense applications.
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a strategic roadmap for cybersecurity implementation throughout the industry.
Sivers Semiconductors Receives CHIPS Act Funding Award from NEMC Hub
$6M award accelerates lab-to-fab development of critical chip technology.
NY CREATES Receives $4.7M National Science Foundation Grant to Launch Semiconductor Workforce Development Program
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) announced today it has been awarded a $4.7 million grant from the National Science Foundation (NSF) to support the establishment of the Education Alliance for Semiconductor Experiential Learning (EASEL) program.
Archer Develops New Manufacturable Carbon Material and Deepens Understanding of Quantum Spin Behaviour
Archer Materials Limited, a semiconductor company advancing the quantum technology and medical diagnostics industries, has developed a highly manufacturable carbon film with attractive quantum properties including long room-temperature electron spin lifetimes.
SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E
SK hynix Inc. announced today that it has begun mass production of the world’s first 12-layer HBM3E product with 36GB, the largest capacity of existing HBM to date.
New Short Film Takes Behind-the-Scenes Look at Next-Generation GaN Power Semiconductor Device Development
ROHM Co., Ltd. has released the sixth German-language installment in the “Stories of Manufacturing” series of short films, this time taking viewers behind the scenes at the development of GaN devices, which are attracting attention as next-generation power semiconductors.
Kopin Receives $1.3M Follow-On Order for Emerald Microdisplay Module
Kopin Corporation, a provider of application-specific optical systems and high-performance microdisplays for defense, enterprise, industrial, consumer and medical products, announced today that it has received a $1.3 million follow-on order for its Emerald microdisplay module in support of a major weapon sight product
