Axus Technology, a global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced strong sales momentum for its innovative Capstone CS200 Series – the industry’s latest CMP processing tool.
Applied Materials Unveils Chip Wiring Innovations for More Energy-Efficient Computing
Applied Materials Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond.
JST Wins New Order for 300mm Ospray Multi-Chamber Single-Wafer Wet Processing System
Highly flexible platform delivers unprecedented flexibility, precision, and repeatability during the etching and deposition process.
Resonac Announces Consortium For Next-Generation Semiconductor Packaging in Silicon Valley
The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US.
Busch Group Companies Announce Joint Presence at SEMICON West
The three companies of the Busch Group (Busch Vacuum Solutions, Pfeiffer Vacuum and centrotherm clean solutions) announce their joint presence at Semicon West 2024. It will be the inaugural occasion that the Busch Group exhibits collectively in one booth in the US.
Flexible and Durable Bioelectrodes: The Future of Healthcare Wearables
The proposed bioelectrode can lead to comfortable and long-lasting wearables for healthcare and fitness applications.
Semiconductor Market Size Is Set to Grow by $112.8B from 2024-2028
The global semiconductor market size is estimated to grow by USD 112.8 billion from 2024-2028, according to Technavio.
Lita Shon-Roy of TECHCET at SEMICON West Presenting on a System to Revolutionize Supply Chain Resilience
Lita Shon-Roy, President/CEO at TECHCET, together with Chris-Han Adebekun, VP of Business Development of Athinia, will be speaking at SEMICON West next week during the “Foundations for a Resilient and Agile Supply Chain” session.
New SEMI Governing Council for Smart MedTech Initiative to Connect Semiconductor and Life Science Communities
SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced the formation of a governing council for its Smart MedTech Initiative that will guide the initiative in its vision to revolutionize global healthcare through innovation, democratization, and pioneering advances in preventative care.
YES Panel-Level Through Glass Via Etch Tool Placed in Production
YES, a manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that Its TersOnus TGV tool was released for panel-level manufacturing.
