North America-based manufacturers of semiconductor equipment posted $2.61 billion in billings worldwide in November 2020 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
Synaptics Expands into Low Power Edge AI Applications with New Katana Platform
Synaptics Incorporated, today announced the Katana Edge AI platform, addressing a growing industry gap for solutions that enable battery powered devices for consumer and industrial IoT markets.
France Awards Soitec-led European Consortium for Semiconductor Innovation
The French Government has granted the REFERENCE consortium led by Soitec, a world leader in semiconductor materials based in France, the “Étoile de l’Europe” (“Star of Europe”) award for innovation in telecommunication.
Aspinity Releases Analog Voice-First Evaluation Kit for Battery-Operated Devices
Aspinity, a pioneer in ultra-low-power analog machine learning processors, launched its Voice-First Evaluation Kit (EVK2), a complete hardware/software development kit that demonstrates Aspinity’s ultra-low-power edge processing solution for analog voice activity detection and preroll.
MagnaChip Introduces First Power Management IC for Laptops with UHD Display Panels
MagnaChip Semiconductor Corporation, announced today a new line of power management integrated circuits (PMIC) by introducing its first UHD display panel PMIC for laptops.
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
SUEZ Unveils New Sievers TOC Analyzers for Online Ultrapure Water Monitoring
SUEZ – Water Technologies & Solutions announced the launch of two new Total Organic Carbon (TOC) online analyzers, the M500 for life sciences and the M500e for microelectronics markets.
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
In an invited paper at IEDM 2020, CEA-List and CEA-Leti, research institutes at CEA, presented their technologies for achieving exascale-level, high- performance computing (HPC).
Combining Forces: LS Laser Systems and EPP Merge to Form L-TRIS
The Photonics Systems Group, a market leader in laser systems for micromaterial processing, is proud to announce the merger of two Group companies, LS Laser Systems and EPP Electronic Production Partners.
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software
Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.
