SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
ClassOne Receives Repeat Order for its Solstice Electroplating System from Major Taiwanese Semiconductor Manufacturer
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice S8 electroplating system to a major semiconductor foundry service based in Taiwan.
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices
Two complementary research papers from CEA-Leti confirmed that the institute’s approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
SiTime Continues Leadership in MEMS Timing Market with 2 Billion Units Shipped
SiTime Corporation today announced that it has cumulatively shipped 2 billion units of its silicon MEMS timing solutions.
SUSS MicroTec Opens New Production Facility in Taiwan
The new SUSS location in the state-funded Science Park in Hsinchu, Taiwan consists of an office and production area and an application, demonstration and training center. The expansion is a necessary step as part of the “SUSS 2025” corporate strategy, which envisages a significant increase in sales.
UMBC Team Reveals Possibilities of New One-Atom-Thick Materials
New computational research makes reliable predictions about desirable properties of new 2D materials, saving experimental researchers time and money and foreshadowing ‘tunable’ materials for particular applications.
Aledia, French Developer of Next-Generation MicroLED Displays for High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12”) silicon wafers.
SEMI Technology Unites Global Summit to Spotlight Digital Transformation, Microelectronics Industry Innovation and Growth
Global industry executives from all seven SEMI regions will gather online for the inaugural SEMI Technology Unites Global Summit, February 15-19, 2021, for keynotes on the power of technology to unite the world and insights on how the microelectronics industry can shape the digital future.
Henkel Debuts Non-Conductive, High Thermal Die Attach Paste with Automotive Grade Reliability
Expanding its line of automotive grade die attach materials for advanced semiconductor packages, Henkel has developed and commercialized LOCTITE ABLESTIK ABP 8920TC.
Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports
Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020.
