An international team of researchers has synthesized curved, infinitely stacking nanographenes — like potato chips in a cardboard can — that can assemble into nanowires.
Proteus Adds SnapEDA CAD Model Search to Boost Electronics Design Productivity
SnapEDA announced a new collaboration that places SnapEDA directly within Proteus’ printed circuit board (PCB) design environment.
New Supply Chain Model for Silicon Wafers
United Silicon Innovation Corporation of Taipei, Taiwan, Phoenix Silicon International Corp. and CGI Americas have announced a new wraparound solution for semiconductor wafer supply and world class recycling.
Axcelis Announces Multiple Shipments of Purion High Energy Systems to Leading CMOS Image Sensor Manufacturers
Axcelis Technologies, Inc. announced today that it has shipped multiple Purion VXE high energy systems to leading CMOS image sensor manufacturers.
MaxLinear Appoints Tsu-Jae King Liu to Its Board of Directors
Dr. Liu has been appointed a Class I director with a term continuing until the 2022 annual meeting of stockholders, effective immediately.
Elliptic Labs Collaborates with Cadence to Bring Advanced Virtual Sensors to More Embedded Systems
Elliptic Labs today announced a collaboration with Cadence Design Systems, Inc. to optimize its machine learning algorithms on Cadence Tensilica HiFi DSPs.
Edwards Invests in New Facility for Cryogenic Pumps, Cryo-Chillers and Related Accessories
Edwards announces an investment in a new building in Haverhill, Massachusetts, expected to be completed during the second quarter 2022.
SiFive and DARPA Collaborate to Bring the Power of RISC-V to Technology Innovation
SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation as part of the DARPA Toolbox Initiative.
CyberOptics to Share Technical Presentation About Airborne Particle Sensing Processes at PhotoMask Japan
CyberOptics Corporation will present a technical paper at PhotoMask Japan on April 20th at 6 p.m. CDT / April 21st at 8 a.m. JST.
Damage from Fire at Renesas Chip Factory Worse Than Initial Reports
Renesas Electronics Corporation today held a second press conference regarding the occurrence of a fire on March 19, 2021 at part of the processes in the N3 Building (300mm line) of Naka Factory (located in Hitachinaka, Ibaraki Prefecture).
