Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Tortuga Logic and DARPA Extend Partnership Through the DARPA Toolbox Initiative

Tortuga Logic Inc. today announced a new licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.

Tachyum Releases Motherboard Emulation for Its Prodigy Processor FPGA Prototype to Manufacturing

Tachyum Inc. today sent the motherboard emulation prototype of its Prodigy Universal Processor FPGA prototype to manufacturing, which, when returned, will be plugged into its recently completed field-programmable gate array (FPGA) emulation Prodigy Processor boards to create a fully functional system, bringing Prodigy one step closer to delivery later this year.

Sussex Scientists Develop Ultra-Thin Terahertz Source

Physicists from the University of Sussex have developed an extremely thin, large-area semiconductor surface source of terahertz, composed of just a few atomic layers and compatible with existing electronic platforms.

Breaking Records Like Baking Bread

Researchers have made unparalleled ultrawide-bandgap semiconductors through temperature and timing, just like baking bread.

SEMI Joins UK Initiative to Promote Cybersecurity Adoption

SEMI today announced its participation as an industry expert in a study by researchers in Coventry University’s Institute for Future Transport and Cities’ (IFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers.

Silicon Wafer Supplier Okmetic Expands Its RFSi Portfolio

Okmetic, the supplier of advanced silicon wafers for the manufacture of microelectromechanical systems and sensors, today announced the release of UF-RFSi, a tailored silicon substrate dedicated for thin film surface acoustic wave (TF-SAW) hybrid structures.

Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion

Magnachip Semiconductor Corporation, the South Korean leader in display and power solutions, today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners.

CAE Strengthens Presence in Asia with Seven New Facilities

CAE, the industry’s first software and data-driven physical commodity trader for semiconductor capital equipment and commodities, announces a strengthened presence in the Asia-Pacificregion with offices in Japan, Taiwan, China, Korea, Singapore, India and Australia.

Deciphering the Secrets of Printed Electronics

We live in a world where we want our electronics to be flexible, bendable and stretchable apart from being intelligent. Printed electronics technology has emerged as the main route to enable this vision.

SME Announces Geoffrey Boothroyd Outstanding Young Manufacturing Engineers

The 14 awardees, age 35 or younger, are being recognized for their exceptional contributions and accomplishments in manufacturing throughout the early stages of their careers.