As 2020 comes to a close, we will undoubtedly look back on the past twelve months as a time in which disruption was the hallmark. Amid the unprecedented socioeconomic upheaval brought about by Covid-19, organizations have had to pivot and strategize, adapt and change in new ways – in a far more agile manner than at any time in history.
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution To Speed Up Deployment of 3D Heterogeneous Integration
EVG320 D2W die preparation and activation system provides seamless integration with
third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding
for 3D/Heterogeneous Integration
Data Sharing Across the Fab And the Cost of Inaction
By Alan Ifould Data collection and analysis, more specifically, turning data into useful information and actionable insight, is the necessary foundation for any progress toward the benefits promised by Smart Manufacturing and Industrie 4.0.
Pfeiffer Vacuum Presents New Turbopumps HiPace 350 and HiPace 450
With the HiPace 350 and 450, Pfeiffer Vacuum presents a turbopump especially dedicated for applications like mass spectrometry, electron-microscopy, metrology tools, particle accelerators and plasma physics. In addition to analytical, vacuum-process and semiconductor technology, their broad range of applications also includes coating, research & development and industrial applications.
Atomera Announces Availability of MSTcadfor Modeling Semiconductor Device Improvements with MST
Atomera Incorporated, a semiconductor materials and licensing company focused on deploying its proprietary silicon-proven technology, today announced immediate availability of MSTcadTM, Mears Silicon Technology computer-aided design, a powerful software tool showcasing the advantages of using MST in a variety of semiconductor devices.
Inphi Launches Industry’s First 7nm 50G PAM4 Platform Solution for Hyperscale Data Centers and AI Networks
Inphi Corporation announced its Polaris Gen2 PAM4 platform, the industry’s first 50G, 28Gbaud PAM4 DSP solution based on low-power 7nm CMOS technology.
STMicroelectronics Recognized for Climate Change Leadership by CDP
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics, has been recognized for leadership in corporate sustainability by global environmental non-profit CDP, securing a place on its prestigious ‘A List’ for tackling climate change.
SEMICON Japan 2020 Virtual Set to Open with Sustainable Industry Growth, Smart Technology in the Spotlight
SEMICON Japan 2020, the largest and most influential gathering of the electronics manufacturing and design supply chain in Japan, opens Friday as a virtual event with sustainable industry growth and the latest industry trends, developments and innovations in focus.
Lattice Launches 2nd Generation Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems
Lattice Semiconductor Corporation, the low power programmable leader, announced the Lattice Mach-NX FPGA family, the second generation in its successful line of secure control FPGAs.
How the 1985 Downturn Set the Silicon Wafer Industry on a Path to Consolidation That Continues Today
By Craig Addison While 2020 will be remembered as annus horribilis for many, it is set to be a record year for dealmaking in the chip industry.
