STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls.
Graycliff Announces Semiconductor Executive and Entrepreneur Dan Rubin as Operating Advisor
Graycliff Partners LP today announced the addition of Daniel Rubin, an experienced operator and investor in the semiconductor equipment industry, as an Operating Advisor. In this role, Mr. Rubin will assist in sourcing and evaluating new opportunities and advise Graycliff’s portfolio companies within its dedicated equity strategy, focusing on the $60+ billion global semiconductor and display manufacturing industry.
Bosch Rexroth Looks Back on 30 Years’ Linear Axes Development
Over the past three decades, Bosch Rexroth’s portfolio of ready-to-install linear axes has been further developed on an ongoing basis. In response to customer requirements, it now focuses on electrification and connectivity.
Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving
Xilinx, Inc. and Continental today announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq UltraScale+ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar.
Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
Lam Research Corp. announced the advanced Striker FE platform, a new processing solution for manufacturing high-aspect-ratio chip architectures.
Reno Sub-Systems Solidifies Electronic Match Market with Nine New Patents
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today announced that it has been awarded nine new patents for its solid-state RF matching network technology.
KLA Announces Enhanced Portfolio of Systems for Advanced Packaging
KLA Corporation announced the launch of the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP die sorting and inspection system and the next generation of the ICOS T3/T7 Series of packaged integrated circuit (IC) component inspection and metrology systems.
Scintil Photonics Appoints Soitec as Board Observer
Scintil Photonics, a developer of silicon photonic fully integrated circuits including laser integration, today announces the appointment of Ionut Radu, director of R&D at Soitec, as an observer on Scintil’s board of directors.
SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations
SEMI Nano-Bio Materials Consortium (NBMC) today released a Request for Proposals (RFP) for innovations in ambulatory monitoring, wearable technologies for cognitive assessment, and innovative power sources for wearable monitors.
Innovative Micro Technology (IMT) Modernizes MEMS Foundry Services with Omega Rapier Plasma Etch Solution from SPTS Technologies
Innovative Micro Technology (IMT), a global leader in the development and production of complex microelectromechanical systems (MEMS), today announced the purchase of an Omega Rapier plasma etch system from SPTS Technologies, a KLA company.
