Faster, smaller, smarter and more energy-efficient chips for everything from consumer electronics to big data to brain-inspired computing could soon be on the way after engineers at The University of Texas at Austin created the smallest memory device yet.
Porotech Launches Groundbreaking Micro-LED Product
University of Cambridge spin-out Porotech has today announced the launch of its first product based on its breakthrough gallium nitride (GaN) production technique that is set to transform the electronics industry. The company has launched the world’s first commercial native red LED epiwafer for micro-LED applications.
Qorvo CEO Bob Bruggeworth Elected Chair of Semiconductor Industry Association
The Semiconductor Industry Association (SIA) Board of Directors today elected Bob Bruggeworth, President, CEO, and Director of Qorvo, as its 2021 Chair and Steve Mollenkopf, CEO and Director of Qualcomm Incorporated, as its 2021 Vice Chair.
Keysight Collaborates With NTU Singapore on Hybrid Vehicle to Everything Communications
Keysight Technologies, Inc. announced a collaboration with Nanyang Technological University, Singapore (NTU Singapore) to develop a transceiver test bench for a hybrid vehicle-to-everything (V2X) communication system.
Perfect Imperfection: Electrode Defects Boost Resistive Memory Efficiency
Resistive switching memory devices offer several advantages over the currently used computer memory technology. Researchers from the MIPT Atomic Layer Deposition Lab have joined forces with colleagues from Korea to study the impact of electrode surface morphology on the properties of a resistive switching memory cell.
Advanced Analysis Software Maximizes OmniScan Users’ Weld Analysis Capabilities
Olympus’ release of its WeldSight companion PC software for the OmniScan X3 phased array flaw detector provides inspectors with powerful tools to push the boundaries of flaw characterization and sizing.
Breaking The Power And Speed Limit of Lasers
Researchers at the George Washington University have developed a new design of vertical-cavity surface-emitting laser (VCSEL) that demonstrates record-fast temporal bandwidth.
New Insights Into Memristive Devices by Combining Incipient Ferroelectrics and Graphene
Scientists are working on new materials to create neuromorphic computers, with a design based on the human brain.
ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.
North American Semiconductor Equipment Industry Posts October 2020 Billings
Following the record-breaking September results, billings of North America-based semiconductor equipment manufacturers continue to show strong results in October.
