Jenoptik’s new UFO Probe technology targets the market for semiconductor equipment and processes for wafer-level testing in microelectronics.
Marvell Announces Industry’s First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
Marvell today unveiled the industry’s first 112G 5nm SerDes solution that has been validated in hardware.
EdgeQ Raises $51M in Funding to Unify 5G and AI in an Open and Programmable Platform to Ignite Edge Networks
EdgeQ Inc, a 5G systems-on-a-chip company, today announced its launch from stealth with $51 million in total funding, including $38.5 million in a Series A round.
CyberOptics to Present Technical Paper ‘Fast, 100% Wafer Bump Metrology and Inspection’ at Virtual IEEE PAINE Conference
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
GaN Systems Expands Power Market with GaN Power Module Evaluation Kits
GaN Systems announced the availability of four new integrated power module evaluation kits: 100V Driver GaN DC/DC Power Stage Module, 650V 150A Half-Bridge IPM, 650V 150A Full-Bridge Module and Driver, and 650V 300A 3-Phase Module and Driver.
Micron Reinforces Commitment to Advance Equal Opportunity for All in Annual Diversity, Equality and Inclusion Report
Micron Technology, Inc. today announced the release of its third annual diversity, equality and inclusion (DEI) report, demonstrating advances with regionalized commitments and initiatives across the U.S., Asia and Europe.
Wet Copper Deposition Materials for ICs and Packages
TECHCET announces that the global market for wet metal deposition materials including electro-chemical deposition (ECD) and plating (ECP) chemistry blends in 2020 is forecast to be US$63 million.
CEA-Leti and Davey Bickford Enaex Extend R&D Collaboration To Bring More Digital Solutions to Mining and Blasting Industries That Improve Safety for Workers and Increase Productivity
CEA-Leti and Davey Bickford Enaex, a worldwide leader in blasting solutions, have extended their joint laboratory for three years to continue development of innovative radio-frequency communication systems that remotely control networks of high-tech wireless electronic detonators.
Kandou Raises $92.3 Million in Series C Funding
Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.
Coventor and CMC Microsystems Expand Collaboration to Further Enable Innovation in Semiconductor and Microsystem Technology Development
Coventor, a Lam Research Company, and CMC Microsystems, manager of Canada’s National Design Network (CNDN), today announced an expanded technology sharing collaboration, bringing advanced software platforms to Canadian academic and startup organizations.
