Scientists employ genetically engineered viruses to produce intuitive color-coded sensors for detecting airborne chemicals.
Peel-Apart Surfaces Drive Transistors to the Ledge
Semiconductor manufacturers are paying more attention to two-dimensional materials, such as transition metal dichalcogenides (TMDs), following the discovery, at KAUST, of an epitaxial growth process of single-crystal TMDs nanoribbons.
Solid State Drive (SSD) Market is Projected to Reach USD 125 Billion by 2026
According to a recent study from market research firm Global Market Insights, The solid state drive (SSD) market is set to witness commendable traction on account of growing demand for high-performance gaming computers and laptops.
Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System
Multibeam Corporation today confirmed it has embarked upon an ambitious project to apply its innovative Multicolumn E-Beam Lithography (MEBL) technology to pattern entire wafers at 45nm and larger nodes, without the use of any masks, for back-end-of-line (BEOL) processing.
Silex Insight and Faraday Extend Strategic Partnership to Deliver Secure IoT and AI Solutions
Silex Insight, a provider for flexible security IP cores, and Faraday Technology Corporation (TWSE: 3035), a ASIC design service and IP provider, announce their collaboration for delivering secure IoT solutions for a wide range of ASIC applications.
GaN-on-SiC Epiwafer Specialist SweGaN Selected for Second Year on Prestigious List of Sweden’s Hottest Tech Startups
SweGaN AB, manufacturer of custom-made GaN-on-SiC epitaxial wafers for components and devices for telecom, satellite, defense and power electronics, announced today the company has been named for the 2nd year in a row to the prestigious Ny Teknik (New Technology) “33 List” of Sweden’s most promising and innovative young companies. This year’s contenders included 270 companies.
SEMICON Taiwan 2020 Hybrid to Lead the Way in AI and 5G Era
Advanced, smart and green manufacturing will take center stage on-site and online September 23-25 as SEMICON Taiwan 2020 gathers industry visionaries and experts for the latest market trends, business opportunities and innovations across the semiconductor supply chain.
ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice LT electroplating system to Jenoptik for manufacturing semiconductor material for high-power diode lasers at its semiconductor production facility in Berlin-Adlershof, Germany.
Fan-Out Wafer Level Packaging for next Generation mmWave Antenna in Package Applications
A*STAR’s Institute of Microelectronics (IME) has collaborated with leading industry players to establish 300mm Wafer Level Package development line (WLP-DL) to drive the application of fan-out wafer level packaging (FOWLP) for achieving innovations in current and next generation system-in-package (SiP).
Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of the year, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
