Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Imec and Ghent University Present a Smart Contact Lens Mimicking the Human Iris to Combat Eye Deficiencies

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies and CMST (an imec-affiliated research group at Ghent University), together with their partners the Instituto de Investigación Sanitaria Fundación Jiménez Díaz (Madrid, Spain) and Holst Centre (an open innovation initiative from imec and TNO, the Netherlands) today presented an artificial iris embedded in a smart contact lens.

COVID-19 Drives Rise in Global Fab Equipment Spending, SEMI Reports

Soaring pandemic-inspired demand for chips that power everything from communications and IT infrastructures to personal computing, gaming and healthcare electronics will drive an 8% increase in global fab equipment spending in 2020 and a 13% increase in 2021, SEMI announced today in its World Fab Forecast report. Rising demand for semiconductors for datacenter infrastructures and server storage along with the buildup of safety stock as U.S.-China trade tensions intensify are also contributing to this year’s growth.

SUSS MicroTec and DELO Announce Collaboration on Imprint Lithography

SUSS MicroTec and DELO cooperate in the optimization of imprint manufacturing processes for the production of wafer-level optics (WLO). These optics are essential for emerging applications in the automotive and consumer electronics industries, among others.

AKHAN Semiconductor’s Latest US Patent Addresses Diamond Film for Consumer Electronic Displays

AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today that it has been issued a patent by the United States Patent Office (USPTO) generally related to systems and methods for transparent diamond electronics.

Producing Technicolor Through Brain-Like Electronic Devices

Structural coloration is promised to be the display technology of the future as there is no fading – it does not use dyes – and enables low-power displays without strong external light source. However, the disadvantage of this technique is that once a device is made, it is impossible to change its properties so the reproducible colors remain fixed. Recently, a POSTECH research team has successfully obtained vivid colors by using semiconductor chips – not dyes – made by mimicking the human brain structure.

Tachyum Opens U.S., EU and NATO Government Business Unit

Tachyum Inc. today announced it is opening a business unit to serve U.S., EU and NATO member Government customers of its Prodigy Universal Processor for demanding HPC, artificial intelligence and machine learning workloads.

Inkron Invests in Augmented Reality Components Development Infrastructure

Inkron, a Nagase Group Company, the global leader of siloxane-based, optically clear Nano-Imprint Lithography (NIL) materials, makes a strategic investment in NIL materials and components development infrastructure.

Semiconductor Manufacturing Equipment Market is Projected to Reach USD 80 billion by 2026

According to a recent study from market research firm Global Market Insights, The adoption of technologies like AI and IoT in fabrication will significantly impact the semiconductor manufacturing equipment market forecast. Software companies are keen on implementing advanced solutions to cater to the rising demands of compact chipsets and growing production.

BrainChip and VORAGO Technologies Agree to Collaborate through the Akida Early Access Program

BrainChip Holdings Ltd, a leading provider of ultra-low power high performance AI technology, today announced that VORAGO Technologies has signed the Akida Early Access Program Agreement.

Kneron Boosts On-Device Edge AI Computing Performance With Cadence Tensilica IP

Cadence Design Systems, Inc. today announced that Kneron, a leading provider of on-device edge AI solutions, has integrated the Cadence Tensilica Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications.