CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
CEA-Leti X-Ray Photon-Counting Detector Modules Target Improved Medical Diagnoses
A novel X-ray photon-counting detector module (PCDM) developed by CEA-Leti and integrated in an X-ray scanner prototype from Siemens Healthineers has shown in clinical trials the potential to revolutionize computed-tomography (CT) scanning by potentially increasing spatial resolution, reducing X-ray exposure to patients, improving image quality by lowering image noise and artifacts, and by distinguishing multiple contrast agents.
A New Way of Modulating Color Emissions from Transparent Films
Scientists are looking at luminescent transparent films for use in energy-efficient displays (such as LED screens) and other applications, and the possibilities it opens up for advancing methodologies in several fields of biological and electronics research.
Continuous and Stable Lasing Achieved from Low-Cost Perovskites at Room Temperature
An international team of researchers led by Kyushu University and Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, has demonstrated stable, continuous lasing at room temperature for over an hour from a class of low-cost materials called perovskites by finally overcoming a phenomenon that has so far prevented such long operation.
Amber Solutions Secures $5.5 Million in Financing and Signs Three New Memorandums of Understanding with Global Manufacturers
Amber Solutions, a technology innovator creating a modern hyper-intelligent electrical architecture, today announced the completion of a new $5.5-million round of financing and the securement of three new memorandums of understanding (MOUs) with leading global manufacturers of electrical products, smart automation systems and silicon chips.
Tachyum Promotes Krishna Thatipelli to Senior Director of Hardware Design Engineering
Tachyum Inc. today announced the promotion of Krishna Thatipelli, a seasoned professional with strong technical and management skills in CPUs and ASIC development, to Senior Director of Hardware Design Engineering after successfully delivering August milestones related to the company’s Prodigy Universal Processor.
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing.
Memory in a Metal, Enabled by Quantum Geometry
The emergence of artificial intelligence and machine learning techniques is changing the world dramatically with novel applications such as internet of things, autonomous vehicles, real-time imaging processing and big data analytics in healthcare.
pSemi Welcomes New Vice President of Sales and Marketing, Vikas Choudhary
pSemi Corporation, a Murata company focused on semiconductor integration, today announces that Vikas Choudhary has joined the company as vice president of sales and marketing. Choudhary will lead pSemi’s worldwide sales, applications engineering, marketing, and marketing communications teams, and he will be responsible for driving pSemi’s unique RF, power, and sensor products into existing and emerging markets.
Cobham Advanced Electronic Solutions Appoints Mike Kahn as Chief Executive Officer
Cobham Advanced Electronic Solutions (CAES), a provider of mission critical electronic solutions, announces the appointment of Mike Kahn as Chief Executive Officer (CEO) effective September 1, 2020. Mike takes over from Shawn Black, who is leaving the business to pursue other opportunities.
