Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announced the appointment of Adam Phan as the company’s new General Manager of Sealing Systems.
Murata Awarded 2024 Supplier of the Year – Best Quality at Qualcomm Supplier Summit
Murata announced that it was awarded with Qualcomm’s 2024 Supplier of the Year – Best Quality at the Qualcomm Supplier Summit in San Diego on August 27.
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys, Inc. today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC’s most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.
Edge Impulse Collaborates with STMicroelectronics to Develop New Capabilities for Edge AI Deployments
Edge Impulse, the platform for building, deploying, and scaling edge machine learning models, and an ST Authorized Partner, has entered into a collaboration with ST on industry-leading solutions for practical applications of AI in edge environments.
Tachyum Expands European Hub with New Offices in Czech Republic
Tachyum today announced the opening of new positions in Brno, Czech Republic, to support the company’s continued growth as it nears tape-out of the Prodigy Universal Processor Chip.
Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.
Soitec and Resonac Announce the Signing of a Joint Development Agreement
Resonac Corporation and Soitec have signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other international markets.
