CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.
Marvell to Acquire Inphi
Marvell Technology Group Ltd. and Inphi Corporation today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Marvell will acquire Inphi in a cash and stock transaction.
Transphorm Releases Latest High Voltage GaN Reliability Data
Transphorm, Inc. (OTCQB: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today released updated information regarding its GaN technology’s quality and reliability (Q+R).
Reliable Quality-Control of Graphene And other 2D Materials Is Routinely Possible
Graphene and other single-atom-thick substances are a category of wonder materials, with researchers the world over investigating their electronic properties for potential applications in technologies as diverse as solar cells, novel semiconductors, sensors, and energy storage.
CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
Eyeing future demand for hack-proof digital communication in a quantum-information world, CEA-Leti today announced plans to build a quantum-photonics platform to develop next-generation technologies for key industries that require ultra-secure data transmission.
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Yokkaichi Plant
Kioxia Corporation today announced it will begin construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH.
An Artificial Cell on a Chip
Researchers at the University of Basel have developed a precisely controllable system for mimicking biochemical reaction cascades in cells.
Surrey Device Takes Us Closer to High-Performing Wearable and Eco-Disposable AI Electronics
The University of Surrey has unveiled a device with unique functionality that could signal the dawn of a new design philosophy for electronics, including next-generation wearables and eco-disposable sensors.
STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore in Partnership with A*STAR and ULVAC
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a world leader in Micro-Electromechanical Systems (MEMS) technology, announces a collaboration with A*STAR’s IME, a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
Dialog Semiconductor Partners with Alps Alpine for Automotive Haptic Applications
Dialog Semiconductor plc, a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial IoT solutions, today announced automotive qualification for its DA7280 high-definition haptic driver.
