STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Sanken Electric Co., Ltd (TSE: 6707), a leader in innovative technology specializing in semiconductor devices, power modules, and sensors, have collaborated to unleash the performance and practical advantages of intelligent power modules (IPM) in high-voltage, high-power equipment designs.
Tom Friedman to Deliver Keynote Address at 2020 SIA Leadership Forum & Award Celebration
The Semiconductor Industry Association today announced Thomas L. Friedman, longtime foreign affairs columnist at The New York Times and bestselling author of The World is Flat, will deliver the keynote address at the 2020 SIA Leadership Forum & Award Celebration.
New Semiconductor Chip from NS Nanotech Emits Far-UVC Disinfectant Ultraviolet Light to Neutralize Coronavirus
NS Nanotech announced today that it has broken major barriers in semiconductor device design with the first solid-state emissive material to produce invisible shortwave far-UVC ultraviolet light that researchers say can deactivate the SARS-CoV-2 virus and other airborne pathogens.
Reviewing Multiferroics for Future, Low-Energy Data Storage
A new UNSW study comprehensively reviews the magnetic structure of the multiferroic material bismuth ferrite (BiFeO3- BFO).
North American Semiconductor Equipment Industry Posts September 2020 Billings
The semiconductor industry remains resilient despite challenges posed by the pandemic and geopolitical tensions.
NEC and Analog Devices Collaborate to Provide 5G O-RAN Massive MIMO Radio for Rakuten Mobile
NEC Corporation and Analog Devices, Inc. announced today that they have teamed up to design a 5G Network Massive MIMO Antenna Radio Unit for Rakuten Mobile.
SiPearl Joins the CXL Consortium Behind Compute Express Link, the Breakthrough CPU-to-Device Interconnect
SiPearl has joined the CXL Consortium, whose founding members are the world leaders Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft.
TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
Synopsys, Inc. today announced it has received four 2020 OIP Partner of the Year awards for IP and EDA solutions from TSMC demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement.
Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
Synopsys, Inc. today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package.
Lattice CrossLink-NX FPGA Wins 2020 EM Best of Industry Award
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, announced the Lattice CrossLink-NX FPGA for embedded vision and AI applications won the Best FPGA Award in the Technology & Product Innovation category at the 2020 EM Best of Industry Awards.
