Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SK hynix to Expand United States Market Presence with the Launch of the World’s First 128-Layer NAND Consumer PCIe NVMe SSD

SK hynix Inc., a global semiconductor supplier based in Korea, announced today the release of its newest PCIe SSD: the SK hynix Gold P31. The latest edition is the world’s first 128-layer NAND Flash-based consumer SSD and the company’s first consumer-facing PCIe SSD launched in the United States under the SK hynix brand.

Transphorm’s Second 900 V GaN FET is Now in Production

Transphorm Inc. announced its second 900 V GaN FET is now in production.

Keysight Enables Telecommunications Technology Association to Support Growing 5G Device Ecosystem in Korea

Keysight Technologies, Inc., a technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that the company’s 5G device test solutions have been selected by Telecommunications Technology Association (TTA), a Korean test house, to offer 5G new radio (NR) radio frequency (RF) and radio resource management (RRM) conformance validation services.

A New Two-Dimensional Carbon Allotrope — Semiconducting Diamane Film Synthesized

Atomically thin diamond, also called diamane, is a two-dimensional carbon allotrope and has attracted considerable scientific interest due to its potential physical properties.

SEMI Launches World’s First Flexible Hybrid Electronics Standards Technical Committee to Promote Industry Growth

SEMI today announced the formation of a new standards committee that aims to develop global standards for flexible hybrid electronics (FHE) spanning design, materials, manufacturing, packaging and systems and to drive industry growth.

IBM Reveals Next-Generation IBM POWER10 Processor

IBM today revealed the next generation of its IBM POWER central processing unit (CPU) family: IBM POWER10.

BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution

BrainChip Holdings Ltd, a leading provider of ultra-low power high performance AI technology, today announced that it has partnered with Magik Eye Inc.

SiFive Announces OpenFive, an Industry-Leading Custom Silicon Business Unit

SiFive, Inc., the provider of commercial RISC-V processor IP and silicon solutions, today announced OpenFive, a self-contained and autonomous business unit to capture the opportunity offered by enabling customizable, silicon-focused solutions with differentiated-IP.

Rahul Goyal of Intel Re-elected Board Chair of Silicon Integration Initiative

Rahul Goyal, vice president and director of R&D strategic enablement at Intel, has been re-elected to a one-year term as chairman of the board of directors of Silicon Integration Initiative, a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Scientists Use Photons as Threads to Weave Novel Forms of Matter

New research from the University of Southampton has successful discovered a way to bind two negatively charged electron-like particles which could create opportunities to form novel materials for use in new technological developments.