Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network.
Veeco Announces Aledia Order of 300mm MOCVD Equipment for microLED Displays
Veeco Instruments Inc. (NASDAQ: VECO) today announced that Aledia, a developer and manufacturer of next-generation advanced display applications, has selected Veeco’s Propel 300 HVM metal organic chemical vapor deposition (MOCVD) system for high- resolution microLED displays.
What’s Driving the Next 10 Years of MEMS?
MEMS sensors have come a long way over the past few decades. The late 1990’s brought us the mass production of both MEMS accelerometers for automotive air bag crash sensors and MEMS gyros for rollover detection and anti-locking braking systems (ABS).
EV Group Addresses Key Process Gap in Heterogeneous Integration with Collective Die-to-Wafer Hybrid and Fusion Bonding Demonstration
This breakthrough, which was demonstrated at EVG’s Heterogeneous Integration Competence Center, represents an important milestone in accelerating the deployment of heterogeneous integration (HI) in next-generation 2.5D and 3D semiconductor packaging.
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
DIALOG SEMICONDUCTOR and GLOBALFOUNDRIES today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.
Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards
Lattice Semiconductor Corporation, the low power programmable leader, announced that both the Lattice Propel design environment and the Lattice CrossLink-NX FPGA family won medals at the 2020 Leadership in Engineering Achievement Program (LEAP) Awards.
Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
Synopsys, Inc. and Samsung Foundry today announced the release of a validated automotive reference flow to streamline SoC hardware design for in-system test, implementation, verification, timing and physical signoff for ISO 26262 compliance.
Semiconductor Industry Announces Research and Funding Priorities to Sustain U.S. Leadership in Chip Technology
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today released a preview of their upcoming “Decadal Plan for Semiconductors,” a report outlining chip research and funding priorities over the next decade that will help strengthen U.S. semiconductor technology and spur growth in emerging technologies such as artificial intelligence, quantum computing, advanced wireless communications.
NTU Singapore Scientists Develop ‘Mini-Brains’ to Help Robots Recognize Pain and to Self-Repair
Using a brain-inspired approach, scientists from Nanyang Technological University, Singapore (NTU Singapore) have developed a way for robots to have the artificial intelligence (AI) to recognise pain and to self-repair when damaged.
ACM Research Highlights Availability of Wafer-Level Packaging Processing Equipment Portfolio for OSAT Customers
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today highlighted the availability of its extended portfolio of wet wafer processing tools designed to meet the advanced technology requirements of outsourced semiconductor assembly and test (OSAT) providers.
