Liwen Sang, independent scientist at International Center for Materials Nanoarchitectonics, National Institute for Materials Science (also JST PRESTO researcher) developed a MEMS resonator that stably operates even under high temperatures by regulating the strain caused by the heat from gallium nitride (GaN).
AKHAN Semiconductor Awarded Additional Major Patents in Taiwan & South Korea
AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronic-grade diamonds, announced today that it has been issued additional patents for invention by the Taiwan and Korean Intellectual Property Offices.
Key Taiwanese Influencer Names Veeco to International Consortium Aimed At Enabling Semiconductor Technology Roadmap
Veeco Instruments Inc. today announced that National Chiao Tung University (NCTU), based in Hsinchu, Taiwan, has selected Veeco to be an essential collaborator in their initiative to drive Taiwan’s semiconductor production through 2035.
Fast, Efficient Ultrasonic Scanning of Large Composite Components
Olympus’ new RollerFORM XL scanner answers the demand for a wide-coverage and easy-to-implement phased array tool to accelerate the inspection of composite components with large surface areas.
Park Systems Selected for Forbes Asia’s Best Under a Billion list for 2020
Park Systems was selected this year for Forbes Asia’s Best Under A Billion list spotlighting 200 top performing publicly listed companies in the Asia-Pacific region with sales under $1 billion.
Power Management ICs Market Is Estimated To Account For US$ 5,142.17 Mn in Terms of Value by the End of 2027
The global power management ICs market is estimated to account for US$ 5,142.17 Mn in terms of value by the end of 2027, exhibiting a CAGR of 5.3% during the forecast period (2020-2027), as highlighted in a new report published by Coherent Market Insights.
Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
Intel today announced that its board of directors has appointed 40-year technology industry leader Pat Gelsinger as its new chief executive officer, effective Feb. 15, 2021. Gelsinger will also join the Intel board of directors upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15.
Gowin Semiconductor Embeds 64Mb HyperRAM DRAM from Winbond
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
SOI Industry Consortium Joins SEMI as Strategic Association Partner
SEMI today announced that the SOI Industry Consortium, a leading industry organization representing the complete SOI-based microelectronics value chain, has joined SEMI as a Strategic Association Partner effective January 1, 2021.
Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability
Onto Innovation Inc. today announced the availability of its new Dragonfly G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced packaging and specialty device manufacturers.
