The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer urging the House of Representatives to pass the Building Chips in America Act (S. 2228).
Jabil Expands Silicon Photonics Capabilities to Enable Next-Generation AI and Data Center Technologies
Jabil Inc. today announced its continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth.
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners.
Lam Research Honors Global Suppliers with 2024 Excellence Awards
Lam Research Corp. today announced this year’s recipients of its annual Supplier Excellence Awards, recognizing nine companies from around the world for performance across a range of categories.
Global Semiconductor Sales Increase 18.7% Year-to-Year in July
Sales into the Americas jump 40.1% year-to-year to lead all markets; worldwide chip sales increase 2.7% month-to-month.
A New Ventilator-on-a-Chip Model to Study Lung Damage
In a new study, using a ventilator-on-a-chip model developed at The Ohio State University, researchers found that shear stress from the collapse and reopening of the air sacs is the most injurious type of damage.
The MMEC Receives Microelectronics Commons Project Awards
The Midwest Microelectronics Consortium (MMEC) announced the award of five technology development projects through Microelectronics Commons
Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
Synopsys, Inc. today announced it has entered into a definitive agreement for the sale of its Optical Solutions Group (OSG) to Keysight Technologies, Inc., a provider of design, emulation and test solutions.
ROHM’s New N-Channel MOSFETs Offer High Mounting Reliability in Automotive Applications
ROHM Semiconductor today announced new N-channel MOSFETs featuring low ON-resistance ideal for a variety of automotive applications, including motors for doors and seat positioning, as well as LED headlights.
Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages
Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process.
