Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
Omdia: All-in-One LED Competing to be the Next Generation of Meeting Room Display
Competition is heating up to be the display technology of choice for the corporate market as All-in-One (AIO) LEDs competes with LCD 21:9 and interactive displays for a slice of the $11.1bn corporate and conference room market in 2028.
Insight Global Launches Semiconductor Apprenticeship Program to Address Talent Shortages
Insight Global announced the launch of its new U.S. Department of Labor-approved Semiconductor Apprenticeship Acceleration Program (SAAP).
NEO Semiconductor Announces the Development of its 3D X-AI Chip
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
Polymatech Electronics Acquires Nisene Technology Group Inc.
Polymatech Electronics, India’s first semiconductor chip maker, has officially announced its acquisition of Nisene Technology Group Inc., California, USA, a company with a 50-year history in the semiconductor industry.
Yongjiang Laboratory Orders Reactive Ion Beam Trimming Equipment from scia Systems
The scia Trim 200 system provides precise surface correction in film and wafer materials using ion beam trimming. The film thickness uniformity can be adjusted up to 0.1 nm.
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024.
Micron Develops Industry’s First PCIe Gen6 Data Center SSD for Ecosystem Enablement
Micron Technology, Inc. today announced it is the first to develop PCIe Gen6 data center SSD technology for ecosystem enablement as part of a portfolio of memory and storage products to support the broad demand for AI.
