A team of South Korean researchers has developed a groundbreaking haptic (tactile) display technology that is attracting global attention.
Aidentyx and Lavorro Announce Strategic Collaboration
Semiconductor AI Virtual Assistant leader Lavorro announced today a strategic partnership with Aidentyx – a supplier of AI powered, asset performance management (APM) analytics solutions for smart sub fab, high-technology and industrial manufacturing.
NY CREATES and CEA-Leti Announce Strategic Research Partnership
NY CREATES and CEA-Leti today announced their strategic partnership that will initially focus on the research and co-development of magnetic memory devices, which are used to store computer data.
A New Experimental Approach to Investigate Defects in Semiconductors
At the Laboratory of Condensed Matter for Physics (PMC), a team has successfully determined the spin-dependent electronic structure linked to the presence of defects in the arrangement of atoms in a semiconductor.
Advanced Energy’s New Impedance Matching Network Provides Ultra-Fast, RF-Synchronized Tuning to Multilevel Pulse States
Advanced Energy Industries, Inc. has unveiled the NavX impedance matching network with algorithms and direct generator communication, enabling superior levels of precise and repeatable plasma control, critical in ‘Angstrom-Era’ fabrication.
Omdia: AMOLED Shipments to Exceed TFT LCDs in the Smartphone Display Market in 2024
AMOLED technology is on a steady rise in the smartphone display market with shipments expected to surpass those of TFT LCDs in 2024, according to Omdia’s latest Smartphone Display Market Tracker.
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.
Silicon Catalyst Ventures Launched to Support Early-stage Semiconductor Startups
Led by a team of seasoned investment and technology experts, in close collaboration with the Silicon Catalyst incubator.
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
Synopsys, Inc. today announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai EDA suite, and Synopsys IP for Intel Foundry’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology.
Xpeedic Releases EDA 2024 Platforms
Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation.
