Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration with GLOBALFOUNDRIES (GF) that resulted in the availability of a Mixed-Signal OpenAccess process design kit (PDK) that supports GF’s 22FDX platform.
Metal Wires of Carbon Complete Toolbox for Carbon-Based Computers
Transistors based on carbon rather than silicon could potentially boost computers’ speed and cut their power consumption more than a thousandfold — think of a mobile phone that holds its charge for months — but the set of tools needed to build working carbon circuits has remained incomplete until now.
GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities
GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities.
Renesas Joins the Global Semiconductor Alliance
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced it has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.
STMicroelectronics Releases KNX-RF Software for Power-Conscious Building Automation
STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls.
Graycliff Announces Semiconductor Executive and Entrepreneur Dan Rubin as Operating Advisor
Graycliff Partners LP today announced the addition of Daniel Rubin, an experienced operator and investor in the semiconductor equipment industry, as an Operating Advisor. In this role, Mr. Rubin will assist in sourcing and evaluating new opportunities and advise Graycliff’s portfolio companies within its dedicated equity strategy, focusing on the $60+ billion global semiconductor and display manufacturing industry.
Bosch Rexroth Looks Back on 30 Years’ Linear Axes Development
Over the past three decades, Bosch Rexroth’s portfolio of ready-to-install linear axes has been further developed on an ongoing basis. In response to customer requirements, it now focuses on electrification and connectivity.
Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving
Xilinx, Inc. and Continental today announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq UltraScale+ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar.
Lam Research Introduces Advanced Dielectric Gapfill Technology to Enable Next-Generation Devices
Lam Research Corp. announced the advanced Striker FE platform, a new processing solution for manufacturing high-aspect-ratio chip architectures.
Reno Sub-Systems Solidifies Electronic Match Market with Nine New Patents
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today announced that it has been awarded nine new patents for its solid-state RF matching network technology.
