Taking a critical step toward developing LiDAR systems for widespread commercial applications, CEA-Leti has developed genetic algorithms to calibrate high-channel-count optical phased arrays (OPAs), as well as an advanced measurement setup enabling wafer-scale OPA characterization.
Revenue per Wafer Climbs as Demand Surges for 5nm/7nm IC Processes
Despite high development costs, smaller nodes bring greater revenue per wafer.
Merck KGaA, Darmstadt, Germany Moves the Silicon Valley Innovation Hub to San Jose’s Intermolecular Site
Merck KGaA, Darmstadt, Germany, a leading science and technology company, has moved its Silicon Valley Innovation Hub team to San Jose’s Intermolecular’s 150,000 sqft facility, creating a unique space for innovation and collaboration at the intersection of life science, healthcare and electronic materials.
BrainChip’s Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
BrainChip Holdings Ltd. ended the 2020 calendar year having made significant strides in the development of its technology backed by the launch of its Early Access Program (EAP), availability of Akida evaluation boards, new partnerships, and expansion of its executive leadership and global facilities.
Semtech to Enable 50Gbps PAM4 Front Haul 5G Wireless Deployment with Industry’s First 5G Front Haul Tri-Edge CDR IC Solution
Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments.
IAR Systems Announces Availability of RISC-V Development Tools with Certification for IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, announces the availability of a certified edition of its development toolchain for RISC-V.
proteanTecs Joins the TSMC IP Alliance Program
proteanTecs, a leading provider of health and performance monitoring solutions for advanced electronics, today announced it has joined the TSMC IP Alliance Program, a key component of TSMC’s Open Innovation Platform (OIP).
Heat-Free Optical Switch Would Enable Optical Quantum Computing Chips
In a potential boost for quantum computing and communication, a European research collaboration reported a new method of controlling and manipulating single photons without generating heat. The solution makes it possible to integrate optical switches and single-photon detectors in a single chip.
Thermo Scientific Spectra Ultra Offers a Leap Forward for Advanced Materials Characterization
Thermo Fisher Scientific, the world leader in serving science, today unveiled the Thermo Scientific Spectra Ultra, a next-generation scanning transmission electron microscope ((S)TEM) that offers structural and chemical insight on a wide range of materials at atomic-scale resolution.
Busch Vacuum Solutions USA Acquires Long-Term Sales Channel Partner
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors and systems, announces the acquisition of Jennings Associates Inc. (dba Jennings Alberts Inc) a distributor for new equipment, maintenance, and repair for vacuum pumps blowers and heat exchangers.
