Semtech Corporation and EchoStar Corporation announced the launch of an initiative to test satellite connectivity services enabled by the LoRaWAN protocol.
Dialog Semiconductor Leads Industrial Digital Transformation with Addition of AI and Data Analytics Partners to SmartServer Ecosystem
Dialog Semiconductor plc announced an expansion of its SmartServer IoT Partner Program to include businesses that offer data analytics platforms with artificial intelligence (AI)-led outcomes that transform industrial operations.
MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the completion of its MIPI Automotive SerDes Solutions (MASS) “display stack.”
Gel-Pak Collaborates with BAE Systems on Packaging Solution for Thin Semiconductor Devices
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
Worldwide sales for March increase 17.8% year-to-year, 3.7% month-to-month.
Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the previous historical high set in the third quarter of 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has locked the process flow for its second chip scale package (CSP).
Dr. Alain Charles Joins Cambridge GaN Devices as Non-Executive Board Member
Cambridge GaN Devices Ltd. (CGD), the fabless semiconductor company spun out of Cambridge University, has announced the appointment of industry veteran Dr Alain Charles as a non-executive board member.
GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York
GLOBALFOUNDRIES announced at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company’s most advanced semiconductor manufacturing facility — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent.
