SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.
Sony Announces Launch of New Low Power Cellular IoT Chipset for NB-IoT Networks – ALT1255
Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets, announced the launch of the Altair ALT1255, a new low-power NB2 chipset. The ALT1255 is 5G ready, designed with an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem.
Fujitsu and University of Toronto Researchers Develop Quantum-Inspired Technology to Optimize Radiation Treatment Plans for Brain Tumors and Other Diseases
Fujitsu Laboratories, Ltd. in collaboration with researchers at the University of Toronto (U of T) today announced the development of a technology for dramatically streamlining the creation of radiation treatment plans for Gamma Knife(1) radiosurgery, leveraging Fujitsu’s quantum-inspired computing technology, the Digital Annealer, which rapidly solves combinatorial optimization problems.
Virtual MSTC 2021 to Showcase Next Wave of Sensorization for Driving Medical and Mobility Advances
Leading-edge MEMS and sensors advances for driving the next generation of medical and mobility applications will take center stage at the SEMI MEMS and Sensors Technical Congress (MSTC 2021), April 13-15, as industry visionaries and experts gather to discuss the latest trends and innovations in sensorization.
The 2021 IEEE International Reliability Physics Symposium Will be Presented as a Virtual Conference
The 2021 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held as a virtual conference due to concerns over the global coronavirus (COVID-19) pandemic.
Samsung Begins Mass Production of Data Center SSD Customized for Hyperscale Environments
Samsung Electronics Co. announced that it has begun mass producing its most advanced line of data center SSDs, the PM9A3 E1.S.
DELO and Infotech Collaborate on 3D Printing System for Multi-material Designs
DELO has collaborated with Infotech, a Swiss-based company that recently introduced a unique and fully-automated system designed specifically for printing liquid materials and multi-material structures, to help with the production of components with different physical property ranges.
SEMI Applauds President Biden, Bipartisan Congressional Leaders for Supporting Semiconductor Supply Chain Incentives
SEMI today released the following statement from president and CEO Ajit Manocha on the support of funding incentives to expand U.S. semiconductor manufacturing and research by President Biden and a bipartisan group of members of Congress in a meeting at the White House on February 24, 2021.
Kioxia Commences Construction of New Fabrication Facility at Yokkaichi Plant
Kioxia Corporation held a groundbreaking ceremony for its semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan.
Micron Launches Low-Power Memory Qualified for Automotive Safety Applications
Micron Technology, Inc. today announced that it has begun sampling the industry’s first automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D.
