Meridian Adhesives Group, a leading manufacturer and custom formulator of high-value adhesives technologies, will now be serving the electric vehicle market with custom solutions by way of the company’s Electronics Division.
ACM Research Introduces Thin Wafer Cleaning System for High-volume Power Semiconductor Device Manufacturing
ACM Research, Inc., a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its Thin Wafer Cleaning System, a high-throughput, four-chamber system designed for single-wafer wet processes, including cleaning, etching and surface finishing.
Microchip Partners with Machine-Learning (ML) Software Leaders to Simplify AI-at-the-Edge Design Using its 32-Bit Microcontrollers (MCUs)
Microchip Technology (Nasdaq: MCHP) today announced it has partnered with Cartesiam, Edge Impulse and Motion Gestures to simplify ML implementation at the edge using the company’s ARM Cortex based 32-bit micro-controllers and microprocessors in its MPLAB X Integrated Development Environment (IDE).
SOT-MRAM Pioneer Antaios Secures 11 Million Dollars in Funding
Antaios, a pioneer in SOT-MRAM technology (Spin-Orbit Torque Magnetic Random-Access Memory), announced today that it has secured 11 million dollars in funding to accelerate innovation and develop new strategic partnerships.
AMD CEO Dr. Lisa Su to Receive Semiconductor Industry’s Top Honor
The Semiconductor Industry Association (SIA) today announced Dr. Lisa Su, president and CEO of AMD and an accomplished leader in advancing semiconductor technology, has been named the 2020 recipient of SIA’s highest honor, the Robert N. Noyce Award.
Samsung Expands Advanced 0.7μm-Pixel ISOCELL Image Sensor Offerings for Wider Mobile Applications
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced four new Samsung ISOCELL image sensors for its 0.7 micrometer (μm)-pixel product lineup; 108-megapixel (Mp) ISOCELL HM2, 64Mp ISOCELL GW3, 48Mp ISOCELL GM5 and 32Mp ISOCELL JD1. With the new 0.7μm ISOCELL technology, Samsung plans to expand the ultra-high-resolution offerings to mainstream smartphones.
2020 IEEE International Electron Devices Meeting To Highlight Innovative Devices for a Better Future
The 66th annual IEEE International Electron Devices Meeting (IEDM), to be held virtually December 12-16, 2020, will uphold the conference’s tradition as the world’s premier forum for the presentation of applied research in transistors and related devices, which are the building blocks of modern electronics technology.
Semiconductor Memory Market: USD 134.95 Billion by 2027
The global semiconductor memory market was valued at more than USD 90 billion in 2019 and poised to grow at a compound annual growth rate (CAGR) of around 6.1% during the forecast period 2020 to 2027.
Samco Launches New PECVD and ALD Facility to Support Growth of Deposition and Coating Business
Samco, a leading manufacturer of plasma processing equipment for the compound semiconductor industry, has announced the opening of its new Plasma Enhanced Chemical Vapour Deposition (PECVD) and Atomic Layer Deposition (ALD) demonstration facility at Samco’s headquarters, Kyoto.
GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series
GLOBALFOUNDRIES (GF) today announced it will launch its Global Technology Conferences (GTC) 2020 series virtually with their first event, GTC North America on September 24.
