Immersion Corporation, the leading developer and provider of technologies for haptics, today announced that it has signed a multi-year license agreement with Woory Industrial Co. Ltd.
NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations to Address Manufacturing Challenges and Improve Reliability
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today released Project Call 6.0 (PC 6.0). The latest call for proposals seeks to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing.
Semiconductor Industry Leaders Urge President Biden to Prioritize Funding for Semiconductor Manufacturing, Research
The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%
Foundries and memory IC suppliers maintain strongest capacity presence.
STMicroelectronics Eases Design of USB Type-C Power Adapters with Highly Efficient Power Delivery and PPS Reference Design
STMicroelectronics has revealed a USB Type-C Power Delivery 3.0 reference design with Programmable Power Supply (PPS) support to accelerate the design of easy-to-use, compact, and efficient power adapters up to 27W with zero-power operation when no cable is connected.
Adapdix Announces SoftBank Funding for Next-Generation Edge AI Platform
Adapdix Corporation, the digital transformation leader in Edge AI automation and intelligent control software, today announced that it has received funding from SoftBank’s Opportunity Fund, pushing the total investment amount secured by Adapdix up to $10 million.
Mouser Stocks Industry’s Widest Selection of Products
Mouser Electronics, Inc. is the industry’s leading authorized New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components.
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
Sensible 4 Tested Autonomous Driving Software in Finnish Lapland
Finnish self-driving technology company was testing its software in the Lapland of Finland for 2,5 weeks. The Temperature went even below -20°C, visibility distance was short, and roads were covered in snow – in other words, conditions were perfect for testing autonomous vehicles.
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
Imec reports for the first time the use of a 13.5 nm High Harmonic Generation source for the printing of 20nm pitch line/spaces using interference lithographic imaging of an Inpria metal-oxide resist under high-numerical-aperture (high-NA) conditions.
