Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NoC) and Physical Layer (PHY) interconnect IP solution.
Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry
Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.
USTC Integrates Wafer-Scale 2D Materials and Metal Electrodes with van der Waals Contacts
A research team led by Prof. ZENG Hualing, Prof. QIAO Zhenhua, and Prof. SHAO Xiang from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences (CAS) achieved progress in studying van der Waals (vdW) contacts for two-dimensional (2D) electrical devices.
Breker Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
Breker Verification Systems, whose product portfolio solves challenges across the functional and system verification process for large, complex semiconductors, today unwrapped its RISC-V CoreAssurance and SoCReady SystemVIP providing a complete range of automated tests for the entire RISC-V core and SoC verification stack.
Omdia Research Finds Weak Demand Leads to Declining Quarter for Semiconductor Market
In the first quarter of 2024, the semiconductor market experienced approximately 2% decline falling to $151.5bn according to Omdia’s new Competitive Landscaping Tool.
CEA-Leti Scientists Detail Progress on 3D Integration Technologies and Promising Approaches for More Than Moore and RF Integrated Systems at VLSI
CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute’s progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.
Renesas Completes Acquisition of Transphorm
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has completed the acquisition of Transphorm, Inc.
QP Technologies Expands Die Preparation Business
QP Technologies, a provider of innovative microelectronic packaging and assembly solutions, today announced it has added a dicing saw to its manufacturing line, expanding its die and wafer preparation business.
Applied Materials Reports Progress on Net Zero 2040 Playbook
Applied Materials, Inc. has published its latest Sustainability Report, detailing the company’s progress over the past year in reducing its carbon emissions and collaborating with customers and partners to drive a more sustainable semiconductor industry.
Automotive Semiconductor Market Surges to $82.82B by 2031
The Global Automotive Semiconductor Market is projected to grow at a CAGR of 5.83% from 2024 to 2031, according to a new report published by Verified Market Research.
